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The Products list classification respects the chronological Steps of manufacturing.
Click on a category to display the related products 
   1 - ELECTRICAL CHARACTERIZATION OF SEMICONDUCTIVE LAYERS
      NEW : SOLAR CELLS CHARACTERIZATION
      A - CHARACTERIZATION BY C-V / I-V
            Measurements of C-V / I-V by NEEDLE PROBING
            MERCURY PROBE C-V characterization Equipment
            Options & Accessories / C-V characterization
      B - RESISTIVITY MEASUREMENT BY 4-POINT PROBE METHOD
            Sheet resistivity 4 POINT-PROBE-SYSTEMS semiconductors range
                        Spécial for USJ junctions leakage measurements
            Configuration : Hand-held resistivity measurement
            Configuration : High resistivity measurement
            Configuration : Very low resistivity measurement
            MERCURY CONTACT Four-Point Probe
            4-POINT-PROBE-HEAD for resistivity measurement
            Micropositioner specific for 4 point probe head
            Options & Accessories / Resistivity measurements
      C - CHARACTERIZATION BY HALL EFFECT
            Hall effect & Other parameters measurement Equipment
            Options & Accessories / Hall effect characterization
   2 - WAFER BACKGRINDING & BACKTHINNING
      A - BACKTHINNING OF INDIVIDUAL DIES (Service)
      B - ADHESIVE TAPE FOR BACKGRINDING
      C - UV CURING SYSTEMS
      D - WAFER BACKLAPPING FILM APPLICATION & REMOVAL
            Wafer backlapping film laminators & Removal
            Options & Accessories for wafer backgrinding lamination & Removal
   3 - VISUAL INSPECTION & OPTICS
      A - Microscopes & Binocular
      B - Objectives and eyepieces
      C - Accessories
            Cameras
   4 - PROBING OF MICROSTRUCTURES
      A - PROBERS FOR ELECTRICAL ANALYSIS AND DEVICE CHARACTERIZATION
            General purpose probers (design, failure analysis, small production...)
            High-Frequency RF & MICROWAVE (up to 500 GHz) probers
            Application-Specific (High-Voltage, Back-side probing, Photonics, MEMS) probers
      B - ACCESSORIES FOR PROBING APPLICATIONS
            Anti-vibration tables
            Microscopes
            Dark boxes - Light isolation
            Precision micropositioners
            Microtools (MEMs testing, biological...)
            Probe holders
            Probe needles
            Specific probes (active-Coaxial-Kelvin...)
            Thermal chucks - Temperature testing
            Lasers for removing metal and layers
            Miscellaneous other accessories
                        Vacuum pump & compressor
            Specific accessories for RF & Microwave applications
                        Specific RF positioner
                        RF-Microwave probes
                        RF & microwave cables
                        Faraday boxes - Electrical isolation
      C - HIGH DENSITY CANTILEVER & VERTICAL PROBECARDS
      D - CLEANING SHEETS FOR PROBECARDS ONLINE CLEANING
   5 - DICING OF SILICON AND OTHER SUBSTRATES
      A - DICING MACHINE
      B - ADHESIVE TAPES FOR WAFERS & SUBSTRATES
            Standard adhesive tapes
            UV adhesive film
      C - WAFER/FRAME FILM LAMINATION
            Wafer/Frame film mounters
            Options & Accessories
      D - DIAMOND DICING WHEELS FOR ALL THIN MATERIALS
            Hubless type used with mounting flanges
            Hubtype blade ready to use
      E - ULTRAVIOLET FILM IRRADIATORS
            UV curing equipment
            Manual UV lamps
            Options & Acessories
      F - FILM EXPANSION AFTER DICING
      G - CLEANING & BRUSHING AFTER DICING
      H - ACCESSORIES RELATED TO DICING
            Plastic rings & Metal frames
            Mounting flanges for Hubless blades
            Other accessories related to dicing
   6 - TESTS OF FINISHED COMPONENTS & BURN IN
      A1 - SOCKETS NEWS
      A2 - STANDARD SOCKETS FOR BURN IN AND TESTS
            BGA/CSP, LGA Packages
            QFN packages
            Specific sockets for high dissipation devices
            Sockets Axial-Radial & MELF packages
            Sockets for TO, SIP, DIP packages
            LCC, FlatPack, SMD, Microwave & Hybrids
            ZigZag sockets & Staggered
            Sockets for PLCC/SOJ & "Gull Wing" packages
            Optical transceiver sockets & PGA
            Connectors
      B - BURN IN BOARDS - HUMIDITY & HAST BOARDS
      C - SPRING TEST PROBES (POGO PINS)
      D - TESTS INTERFACE BOARDS
      E - INSTRUMENTS & SOFTWARES
   7 - COMPONENT HANDLING & PACKAGING MATERIALS
      Microhandling & Micro-tools
   8 - SUBCONTRACT SERVICES PROTOTYPES
 
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