EQUIPMENT FOR DICING AND RELATED PROCESSES

Our range of equipment will allow you to :
Laminate the tape onto the wafer/substrate to dice, easily and reproducibly
Cut your substrate Silicon based or hard type ceramic or glass, separate your dies
Expand the tape if necessary for a gentle pick-up of your parts with no damage
Cure the tape (
UV sensitive tape) after dicing if needed to easily remove the parts

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171