NEW ! Thermal forcing system providing hot and cold temperature
Our Test and burn-in Sockets accommodate ALL packages, Standard or Custom
NEW : Ovens and burn in chamber for bringing temperatures on devices or sub-assemblies

EQUIPMENT FOR DICING AND RELATED PROCESSES

Our range of equipment will allow you to : • Laminate the tape onto the wafer/substrate to dice, easily and reproducibly • Cut your substrate Silicon based or hard type ceramic or glass, separate your dies • Expand the tape if necessary for a gentle pick-up of your parts with no damage • Cure the tape (UV sensitive tape) after dicing if needed to easily remove the parts

Request information about : EQUIPMENT FOR DICING AND RELATED PROCESSES

You have the right to access, modify, amend and delete information about yourself (art. 34 of the "Freedom and Information" act). In order to exercise this right you can contact: Microworld – 5 Rue de la Verrerie, 38120 Fontanil-Cornillon - Tel: 04 76 56 16 17

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171