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UH114-x      Manual wafer/frame film mounter

UH114-x      Manual wafer/frame film mounter

Product Images Technical Specifications Associated Products

Part Number



Manual wafer/frame film mounter


Technical Specifications

Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

  • Temperature controlled platen
  • Buil-in circular cutter for cutting film on film frame, build-in end cutter for film separation
  • Operates with backed or non backed films
  • Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)



  • UH114 : 6" version
  • UH114-8 : 8" version
  • UH114-12 : 12" version

Wafers & Substrates diameter

6, 8, 12 Inch


Non contact chuck, antistatic bar, bakup tape winding

Associated products

UH130-x - Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm. Temperature-controlled heated stage3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132Upper and lower clamp assembly for different size wafersIncreases throughput and yield through gentle die separationEmergency Stop with manual clamp ...
NDS200 - Dicing machine for wafers / substrates
The NDS200 is perfectly adapted to research laboratories and small etamp; Medium production for dicing of thin semiconductor and related materials : Si, GaAs, Linb0", LitAO3...And hard materials glass, ceramic, quartz... Accept dicing blades both "hubtype" or "hubless" style up to 3" diameterProcess parameters are inserted with a built in computerMovement control by joystick for non standard applications (irregular stepping, different depths of cut...) or from memory storing the recipesA user-friendly and flexible machine for a large range of dicing applications ...
FF-xx - Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12") Standard material Stainless steel (alu optional)Sizes and shapes adapted to the dicing equipment, Plastic models available for shipping purposes ...
F20-xx - UV Dicing Tape
PVC based film with UV sensitive adhesiveGood and homogeneous expansion after dicing in order to separate the dies for a safe pickingThe UV features alllow a high adhesion while dicing and a low adhesion after UV curing for pickingBacking layerPackaged in roll hermetic packing (metallized sleeve) ...
F07-xx - Standard Dicing Tape
Medium adhesion forcePVC expandable base with acrylic adhesiveNo silicone (contaminants-free)Packaged in roll...
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171