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UH115-x      Semi-automatic wafer/frame film mounter

Description Technical Specifications Documents Associated Products

UH115-x      Semi-automatic wafer/frame film mounter

Description Technical Specifications Documents Associated Products

Part Number

UH115-x

Designation

Semi-automatic wafer/frame film mounter

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Description

Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

• "Crease line-free" lamination area
• Temperature controlled platen
• Buil-in circular blade wheel for cutting film on film frame
• Operates with backed or non backed films, accepts all film frame
• Vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...)
• Buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size)

MOST POPULAR REFERENCES :

  • UH115 : 6" version
  • UH115-8 : 8" version
  • UH115-12 : 12" version

Technical Specifications

Wafers & Substrates diameter

Options

8, 12 Inch

Non contact chuck, antistatic bar, bakup tape winding

Associated products

UH130-x - Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm.

• Temperature-controlled heated stage
• 3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132
• Upper and lower clamp assembly for different size wafers
• Increases throughput and yield through gentle die separation
• Emergency Stop with manual clamp
UH114-x - Manual wafer/frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

• Temperature controlled platen
• Buil-in circular cutter for cutting film on film frame, build-in end cutter for film separation
• Operates with backed or non backed films
• Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)
FF-xx - Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

• Standard material Stainless steel (alu optional)
• Sizes and shapes adapted to the dicing equipment, 
• Plastic models available for shipping purposes
F20-xx - UV Dicing Tape
• PVC based film with UV sensitive adhesive
• Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
• The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
• Backing layer
• Packaged in roll hermetic packing (metallized sleeve)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171