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F20-xx      UV Dicing Tape

F20-xx      UV Dicing Tape

Product Images Technical Specifications Associated Products

Technical Specifications

  • PVC based film with UV sensitive adhesive
  • Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
  • The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
  • Backing layer
  • Packaged in roll hermetic packing (metallized sleeve)

MOST POPULAR REFERENCES

  • F20-6.0 : 152 mm width
  • F20-10 : 254 mm width
  • F20-11.0 : 280 mm width
  • F20-12.0 : 305 mm width

Lenght

100 m

Width

25 to >450 mm

Color

Transparent

Adhesion force on Si before UV

375@30' 308@24hr g/25mm

Adhesion force on Si After UV

20@30' 14@24hr g/25mm

Thickness

95 mm

Associated products

NDS200 - Dicing machine for wafers / substrates
The NDS200 is perfectly adapted to research laboratories and small etamp; Medium production for dicing of thin semiconductor and related materials : Si, GaAs, Linb0", LitAO3...And hard materials glass, ceramic, quartz... Accept dicing blades both "hubtype" or "hubless" style up to 3" diameterProcess parameters are inserted with a built in computerMovement control by joystick for non standard applications (irregular stepping, different depths of cut...) or from memory storing the recipesA user-friendly and flexible machine for a large range of dicing applications ...
UH114-x - Manual wafer/frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm. Temperature controlled platenBuil-in circular cutter for cutting film on film frame, build-in end cutter for film separationOperates with backed or non backed filmsVacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..) ...
UH130-x - Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm. Temperature-controlled heated stage3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132Upper and lower clamp assembly for different size wafersIncreases throughput and yield through gentle die separationEmergency Stop with manual clamp ...
UH104-x - Manual UV curing system
Benchtop low-profile system, the UH104 offers an exceptional flexibility and repeatability in the curing of UV films for dicing or backgrinding. • Manual loading, automatic UV process Replaceable ozone-free UV lamp 365nmIdeal for Low volume and RnD applicationsAvailable in 8" (and smaller) or 12" version ...
FF-xx - Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12") Standard material Stainless steel (alu optional)Sizes and shapes adapted to the dicing equipment, Plastic models available for shipping purposes ...
LMxx - Metal bond Dicing blade hubtype serie
Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices. Ready to mount on the dicing machine ( hubtype models)Available in various thicknesses / exposures Diamond grit sizes range adapted to all dicing applications ...
LRxx - Hubless resin dicing blades
Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above. Hubless type, mount inside a flange separately supplied and interchangeable after useVariety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicingChoice of bond hardnesses to favorize lifetime or quality of cut ...
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171