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FF-xx      Wafer film frame used for dicing wafer-substrate

Description Technical Specifications Documents Associated Products

FF-xx      Wafer film frame used for dicing wafer-substrate

Description Technical Specifications Documents Associated Products

Description

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

• Standard material Stainless steel (alu optional)
• Sizes and shapes adapted to the dicing equipment, 
• Plastic models available for shipping purposes

MOST POPULAR REFERENCES :

  • FF108 : For 8'' wafer, ID= 9.842", OD = 11.643"
  • FF070 : For 150mm wafer, ID = 7.638 OD = 8.976
  • FFxxx : Other wafer sizes, please consult

Technical Specifications

Wafer size

Inside diameter

Outside diameter

Thickness

Material

4, 6, 8, 12 mm

Upon reference

Upon référence

1.22 mm

Stainless Steel, Aluminium, plastic

Associated products

UH130-x - Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm.

• Temperature-controlled heated stage
• 3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132
• Upper and lower clamp assembly for different size wafers
• Increases throughput and yield through gentle die separation
• Emergency Stop with manual clamp
UH114-x - Manual wafer/frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

• Temperature controlled platen
• Buil-in circular cutter for cutting film on film frame, build-in end cutter for film separation
• Operates with backed or non backed films
• Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)
AP-xx - Plastic Grip-Ring for wafers up to 12
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material.

• They can hold the expanded plastic film and the dies largely separated for a safe picking
• Available for wafers up to 300 mm

F20-xx - UV Dicing Tape
• PVC based film with UV sensitive adhesive
• Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
• The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
• Backing layer
• Packaged in roll hermetic packing (metallized sleeve)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171