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Wafer frame laminators

EQUIPMENT FOR DICING AND RELATED PROCESSESWafer frame laminators

EQUIPMENT FOR DICING AND RELATED PROCESSES - Wafer frame laminators

Robust and user-friendly, these sytems are operator-non-dependent and will laminate the tape onto the wafer quickly and without bubbles
• Supplied in 8 or 12 inches
• Two models : Manual UH114 or semi-automatic UH115
• Options such as backing tape roller, antistatic bar, non-contact vacuum chuck...
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UH114-x
Manual wafer/frame film mounter
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Manual wafer/frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

• Temperature controlled platen
• Buil-in circular cutter for cutting film on film frame, build-in end cutter for film separation
• Operates with backed or non backed films
• Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)
UH115-x
Semi-automatic wafer/frame film mounter
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Semi-automatic wafer/frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

 • "Crease line-free" lamination area
• Temperature controlled platen
• Buil-in circular blade wheel for cutting film on film frame
• Operates with backed or non backed films, accepts all film frame
• Vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...)
• Buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617
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EQUIPMENT FOR DICING AND RELATED PROCESSES

CONSUMABLE FOR DICING PROCESSES

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5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171