Wafer frame laminators

EQUIPMENT FOR DICING AND RELATED PROCESSESWafer frame laminators

EQUIPMENT FOR DICING AND RELATED PROCESSES - Wafer frame laminators

Robust and user-friendly, these sytems are operator-non-dependent and will laminate the tape onto the wafer quickly and without bubbles
• Supplied in 8 or 12 inches
• Two models : Manual UH114 or semi-automatic UH115
• Options such as backing tape roller, antistatic bar, non-contact vacuum chuck...
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UH114
Manual wafer / frame film mounter
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Manual wafer / frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

- Tape uniform tension
- Temperature controlled chuck
- Built-in circular cutter for cutting film on film frame, built-in end cutter for film separation
- Operates with backed or non backed films (UV tape)
- Accept metallic and plastic frames
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
UH115
Semi-automatic wafer / frame film mounter
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Semi-automatic wafer / frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617
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5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171