Paul has recently joined our Sales Team as Semiconductor materials and technology specialist, please welcome him on-board

Our Products family N°1 : Equipment’s and accessories for semiconductor materials electrical characterization

Some New products arriving soon : Thermal conditioning systems for temperature characterisation, 4-Point-Probe with Evolutive customised software…

Next shows events : ERMS Nice France 27-31 September, EuMW European Microwave Week Paris France 1-3 October

CatalogEQUIPMENT FOR DICING AND RELATED PROCESSES Wafer frame laminators

Wafer frame laminators

Robust and user-friendly, these sytems are operator-non-dependent and will laminate the tape onto the wafer quickly and without bubbles • Supplied in 8 or 12 inches • Two models : Manual UH114 or semi-automatic UH115 • Options such as backing tape roller, antistatic bar, non-contact vacuum chuck...

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UH114-x

Manual wafer/frame film mounter

Wafers & Substrates diameter : 6, 8, 12 Inch

Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm. Temperature controlled platenBuil-in circular cutter for cutting film on film frame, build-in end cutter for film separationOperates with backed or non backed filmsVacuum securing wafer stage offered in 2 versions (standard or thin-wafer-ch...

UH115-x

Semi-automatic wafer/frame film mounter

Wafers & Substrates diameter : 8, 12 Inch

Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12". "Crease line-free" lamination areaTemperature controlled platenBuil-in circular blade wheel for cutting film on film frameOperates with backed or non backed films, accepts all film frameVacuum securing wafer stage offered in different versions (standard, edge contact with only ...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

Products Categories

PROBE STATIONS

ACCESSORIES FOR PROBE STATIONS

TEST PROBES

EQUIPMENT FOR THIN LAYER CHARACTERIZATION

PRODUCTS FOR COMPONENTS TESTÌNG AND BURN IN

EQUIPMENT FOR DICING AND RELATED PROCESSES

CONSUMABLE FOR DICING PROCESSES

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL