Resin diamond blades are specifically designed for high-precision cutting applications in the semiconductor industry. Thanks to their optimized structure, they offer a smooth and controlled cutting action, minimizing mechanical stress on components while ensuring excellent surface finish quality.
Particularly suited to fragile materials and thin wafers, they produce clean cuts with minimal chipping and micro-cracks.
The resin bond ensures constant renewal of the diamond grains during the cutting operation, guaranteeing an excellent balance between performance, surface finish quality, and wear control. This technology is especially recommended when the quality of the cutting edge and component protection are critical requirements.
Advantages:
• Excellent surface quality after cutting
• Significant reduction in chipping and edge defects
• Low mechanical stress on sensitive substrates
• Precise and consistent cutting
• Wide range of diamond grit sizes
• Optimized production throughput
• Compatible with leading diking equipment on the market
Applications:
- Silicon (Si) wafers
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Technical glass and ultra-thin glass
- Advanced ceramics
- Electronic substrates
- Optoelectronic components
- MEMS, sensors, and power devices
- Technology dedicated to precision
5 rue de la Verrerie
38120 Le Fontanil-Cornillon
Grenoble / France
Fax : +33(0) 476 757 484
RCS Grenoble B 381 001 171 - APE 4652Z
TVA FR 48 381 001 171