Probing a packaged device

• Wafer size : Individual die, partial wafer, max 100 mm

Economical probe station available in three models for wafers up to 100 mm X-Y travels of 100 mmQuick platen liftUp to 6 micropositioners and a probecard ...

• Wafer size : Individual die, partial wafer, max 200 mm
  
• Chuck travel X-Y : 200/300 mm

The S1160 will support a broad range of precision probing applications including IV, CV, dies, wafers... Modular, it can accept many options and accessories for multi-purpose (temperature, low current...) applications Accept basic microscope (bino / trino) or high power multi-objectives microscopeQuick platen lift allows replacing the wafer under test easilyHigh frequency RF version available WL11...

• Magnification range : 7.5X à 50X (Max 130X depending on used ocular)
  
• Illumination : Not included (optical fiber or Led)
  
• Internal zoom : 0.75, 1, 2, 3, 4, 5 X

Microscope with trinocular (camera optional) zoom body with continuous zoom range, ultra-long working distance providing a comfortable working area below the objective. High quality optics with amazing clarity and depth of viewComplete image parfocalityA complete range of options and accessories allows qualifying the SMZ168 serie for each application where highest magnification is not an issue...