ApplicationTEST ON PACKAGED DEVICESProbing a packaged device

Probing a packaged device

A packaged device can be possibly tested under needles for failure analysis purposes. The die needs to be accessed by chemical etching or mechanical opening of the cover. A specific accessory is then needed to hold the device while testing with a probe station accepting the specific holder. Microworld offers the global solution.
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S1160
General purpose probe station
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General purpose probe station
The S1160 will support a broad range of precision probing applications including IV, CV, dies, wafers...
Modular, it can accept many options and accessories for multi-purpose (temperature, low current...) applications

- Quick platen lift allows contact / no contact
- Accept microscope (bino / trino)
- Accept wafers up to 8'' (wafers 200mm)
- Angular wafer setup
- Allows up to 8 DC micropositioner or probe card
- Heavy body for better stability

MOST POPULAR REFERENCES

S1160A-8N : Moving of optical bridge for turret microscope
S1160B-8N : Moving of optical bridge for trinocular stereozoom microscope
S1160C-8N : Fixed optical bridge for trinocular stereozoom microscope
SMZ168
Stereozoom microscope
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Stereozoom microscope
Stereozoom microscope with trinocular head for probe tip placement.

- High working distance (WD = 113 mm)
- C-mount for digital camera
- Several objectives and eyepieces for wide range of magnification
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617
Products Categories

PROBE STATIONS

ACCESSORIES FOR PROBE STATIONS

TEST PROBES

EQUIPMENT FOR THIN LAYER CHARACTERIZATION

PRODUCTS FOR COMPONENTS TESTÌNG AND BURN IN

EQUIPMENT FOR DICING AND RELATED PROCESSES

CONSUMABLE FOR DICING PROCESSES

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL

ELECTRICAL TESTS UNDER NEEDLES

TEST ON PACKAGED DEVICES

DICING OF SUBSTRATES

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Grenoble / France

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