TEST ON PACKAGED DEVICESProbing a packaged device

S1160General purpose probe station

The S1160 will support a broad range of precision probing applications including IV, CV, dies, wafers...
Modular, it can accept many options and accessories for multi-purpose (temperature, low current...) applications

- Quick platen lift allows contact / no contact
- Accept microscope (bino / trino)
- Accept wafers up to 8'' (wafers 200mm)
- Angular wafer setup
- Allows up to 8 DC micropositioner or probe card
- Heavy body for better stability

MOST POPULAR REFERENCES

S1160A-8N : Moving of optical bridge for turret microscope
S1160B-8N : Moving of optical bridge for trinocular stereozoom microscope
S1160C-8N : Fixed optical bridge for trinocular stereozoom microscope

SMZ171Stereozoom microscope

Stereozoom microscope with middle magnification for probe tip placement.

- High working distance (WD = 110mm)
- C-mount for digital camera (trinocular version)
- Several objectives and eyepieces for wide range of magnification
- LED or optical fiber illumination available

ABOUT : Probing a packaged device

A packaged device can be possibly tested under needles for failure analysis purposes. The die needs to be accessed by chemical etching or mechanical opening of the cover. A specific accessory is then needed to hold the device while testing with a probe station accepting the specific holder. Microworld offers the global solution.

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

Products Categories

LAYER CHARACTERIZATION

COMPONENTS TESTÌNG AND BURN IN

BACK-END PROCESSING

PROBE TESTING

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL

ELECTRICAL TESTS UNDER NEEDLES

TEST ON PACKAGED DEVICES

DICING OF SUBSTRATES

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171