DICING OF SUBSTRATESCuring UV tape after dicing

UH104Manual UV curing system

Benchtop low-profile system, the UH104 offers an exceptional flexibility and repeatability in the curing of UV films for dicing or backgrinding.UV insolators are illumination systems allowing the rapid curing of all types of photo-sensitive materials. Mainly used in the semiconductor world, they solidify the glue present on the adhesive films used during the cutting process. Safe for the environment, this UV curing process takes place at room temperature and at a wavelength of 365nm.

Technical specifications:

• Compact 8" or 12" system
• Manual loading, automatic process
•Rectangular substrates up to 12"
• Environmentally friendly, ozone-free UV lamp
• Fast curing time
• Easily programmable microprocessor based controller
• Repeatable manual operation
• Exceptional cost/performance ratio
• Low temperature 365nm UVA curing process
• Very energy efficient
• Quartz glass window
• Lamp intensity measurement port

Options:

- LED version possible
- Motorized and rotating work platform
- 6" or 8" film frame adapter
- UV Lamp Intensity Radiometer (requires sensor/attenuator assembly, below)
- Sensor/attenuator assembly (requires radiometer above)

F20UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)

F42UV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)

F43UV antistatic dicing tape

F44UV antistatic dicing tape

F27UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- Poly-Olefine based with acrylic adhesive and PET backing layer
- The UV sensitive adhesive offers a high adhesion force during dicing turning very low after UV cure ideal for dies pick up
- PVC core
- Packaged in roll hermetic packing (metallized sleeve)

ABOUT : Curing UV tape after dicing

The UV sensitive adhesive tape offers an interesting feature with two adhesion forces (tackiness), one pretty high is particularly appreciated during dicing of small or fragile dies to hlod them very firmly, Another very low is appreciated after dicing for a gentle pick up with no stress to the die. To obtain the low adhesion value the tape needs to be cured by UV rays with specific power and wavelenght. Microworld offers both the curing equipment and the UV tape both paired for a repeatable process.