Logo Microworld - caractérisation électrique sous pointes
Logo Microworld - caractérisation électrique sous pointes
Spécialiste de l'analyse et de la caractérisation électrique sous pointes
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  • Business / Expertise
  • Products
    • LAYER CHARACTERIZATION
      Four point probe systemsManual systemsSemi-automatic systemsHandheld systemsFour point probe headsCalibration wafersHall effect measurement systemsStandard systemsSpecial systemsSample holdersNon destructive measurement systemsManuals systemsSemi-automatic systemsHandheld systemsMaterial analysis systemsOptical profilometersMechanical testersTribometersEllipsometerMercury contact probing systemsHot plateRTP (Rapid Thermal Processing)
    • PROBE TESTING
      Probe stationsManual probe stationsSemi-automatic probe stationsCompact thermal probe stationsTest accessoriesDark boxesCamerasSpecific chucksThermal chucksMeasurement softwaresMicropositionersMicroscopesProbe holdersAntivibration TablesTest probesPassive probe tipsRF and mmW probesCoaxial and Kelvin probesMulticontact probesActive probesProbecardsAccessories (PS, cleaning, calibrating)
    • BACK-END PROCESSING
      Wafer film frame laminator machinesDicing machinesScriber systemTape expander machinesUV curing machinesDie Bonder SystemWire Bonder systemNano-printing machinesBack-end consumablesAdhesive tapesDiamond dicing bladesWafer film framesPlastic grip ringsClean room accessoriesShipment and storageHandling toolsCleaning
    • COMPONENTS TESTÌNG AND BURN IN
      Oven and thermal conditioning systemsTest and Burn in socketsBurn in boards
  • Applications
    • CHARACTERIZATION OF ELECTRONIC LAYERS
      4-Point ProbingManual 1 Point or few PointsAutomatic with MappingHall Effect Measurements and other parametersMercury contact probingValue for low K & High KGrowing layers by RTP (Rapid Thermal Processor)
    • INSTRUMENTATION CONTROL
      Softwares for controlling Instruments
    • ELECTRICAL TESTS UNDER NEEDLES
      IV / CV Measurements & Failure analysisLow-Leakage-Current TestingHigh Power ProbingHF & Microwave ProbingProbing under VacuumProbing with a probecard & Mapping
    • TEST ON PACKAGED DEVICES
      Testing a new packaged componentBurn in of components for reliability testingProbing a packaged deviceProbing on a non flat substrate
    • DICING OF SUBSTRATES
      Laminating Adhesive tape on Wafers and FramesPost Dicing Tape expansionWafers and other materials DicingCuring UV tape after dicing
  • Contact

CHARACTERIZATION OF ELECTRONIC LAYERSMercury contact probing

  • Value for low K & High K

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