TEST ON PACKAGED DEVICESTesting a new packaged component

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Standard test socket for BGA packages

SOKBGAStandard test socket for BGA packages

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer
Standard test socket for QFN packages

SOKQFNStandard test socket for QFN packages

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer
Test socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)

SOKLCCTest socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)

Burn in and Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

 • Spacing between pads (pitch) depending on case, temperature, options
• Several socket designs of all styles in ClamShell, Open Top, screw fixing...with type C contacts, balls, pogo pins...
• Double height contact options
• Easy installation and unloading of the component
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer


Customized Test Socket

SOKCUSTCustomized Test Socket

Burn in and Test socket specifically developped according to Customer SpecSheet for a particular component and associated test environment.

 • Applications : HF, high power, failure analysis on packaged devices, new packages testing...
• Fabrication in two steps : Drawing release (2 weeks) - Approval - Fabrication (typical 6 weeks)
• This socket will totally match your application as being developed for it
ABOUT : Testing a new packaged component
A new packaged component will need to be inserted in a specific receptacle (socket) in order to access its inputs/outputs.
Upon reviewing of a mechanical device drawing, Microworld will first offers a suited solution to accomodate the package. The specific socket shall take in consideration not only the physical dimensions of the device but also the specific tests requirements in term of current, voltage, leakage, frequency...
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171