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Wafers and other materials Dicing

The dicing process applies to all substrates used in microelectronics devices, Silicon and associated, glass, ceramic...Upon the substrates specificities, thickness, sier, hardness...It will be necessary to use the perfect equipment configured for accepting your substrates range. The dicing here is mechanical, by use of a diamond coated blade, it is commonly used in the semiconductor technical world.
F07-xx
Standard Dicing Tape
Standard Dicing Tape
• Medium adhesion force
• PVC expandable base with acrylic adhesive
• No silicone (contaminants-free)
• Packaged in roll
F08-xx
Standard Dicing Tape Medium-High Tackiness
Standard Dicing Tape Medium-High Tackiness
• Medium-High adhesion force
• PVC expandable base with acrylic adhesive
• No silicone (contaminants-free)
• Packaged in roll
F09-xx
Standard Dicing Tape low tackiness
Standard Dicing Tape low tackiness
• Low adhesion force
• PVC expandable base with acrylic adhesive
• No silicone (contaminants-free)
• Packaged in roll
F05-xx
Standard Dicing Tape
Standard Dicing Tape
• Medium adhesion force
• PVC expandable base with acrylic adhesive
• No silicone added (Contaminants-free)
• Packaged in roll
F04-xx
Standard Thick Dicing Tape
Standard Thick Dicing Tape
• Medium-high adhesion force
• PVC expandable base with acrylic adhesive
• No silicone added (Contaminants-free)
• Packaged in roll
F03-xx
Standard High-Adhesion Dicing Tape
Standard High-Adhesion Dicing Tape
• Medium-high adhesion force
• PVC expandable base with rubber adhesive
• No silicone added (Contaminants-free)
• Packaged in roll
F20-xx
UV Dicing Tape
UV Dicing Tape
• PVC based film with UV sensitive adhesive
• Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
• The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
• Backing layer
• Packaged in roll hermetic packing (metallized sleeve)
F42-xx
UV Antistatic Dicing Tape
UV Antistatic Dicing Tape
• Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
• The tape has an antistatic layer which dissipates the negative charge build-up
• The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
• Packaged in roll hermetic packing (metallized sleeve)
F43-xx
UV Antistatic Dicing Tape
UV Antistatic Dicing Tape
• Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
• The tape has an antistatic layer which dissipates the negative charge build-up
• The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
• Packaged in roll hermetic packing (metallized sleeve)
F44-xx
UV Antistatic Dicing Tape
UV Antistatic Dicing Tape
• Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
• The tape has an antistatic layer which dissipates the negative charge build-up
• The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
• Packaged in roll hermetic packing (metallized sleeve)
F27-xx
High tack UV tape
High tack UV tape
• PolyOléfine based with acrylic adhesive and PET backing layer
• The UV sensitive adhesive offers a high adhesion force during dicing turning very low after UV cure ideal for dies pick up
• PVC core
• Packaged in roll hermetic packing (metallized sleeve)
LMKS-X
Metal Dicing blade hubtype serie K&S
Metal Dicing blade hubtype serie K&S
Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

• Ready to mount on the dicing machine ( hubtype models)
• Available in various thicknesses / exposures 
• Diamond grit sizes range adapted to all dicing applications
LMFI-X
Metal Dicing blade hubtype
Metal Dicing blade hubtype
Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

• Ready to mount on the dicing machine ( hubtype models)
• Available in various thicknesses / exposures 
• Diamond grit sizes range adapted to all dicing applications
LRxx
Hubless resin dicing blades
Hubless resin dicing blades
Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above.

• Hubless type, mount inside a flange separately supplied and interchangeable after use
• Variety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")
• The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicing
• Choice of bond hardnesses to favorize lifetime or quality of cut
MW-FL
Flange for hubless dicing blades
Flange for hubless dicing blades
Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

• Material stainless steel or Titanium
• For blades up to 60 mm diameter
• The flange OD determines the blade exposure
• A dismounting tool (separately supplied) is needed to disassemble the flange

FF-xx
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

• Standard material Stainless steel (alu optional)
• Sizes and shapes adapted to the dicing equipment, 
• Plastic models available for shipping purposes
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171