Paul has recently joined our Sales Team as Semiconductor materials and technology specialist, please welcome him on-board
Some New products arriving soon : Thermal conditioning systems for temperature characterisation, 4-Point-Probe with Evolutive customised software…
Next shows events : ERMS Nice France 27-31 September, EuMW European Microwave Week Paris France 1-3 October

Wafers and other materials Dicing

Serie of systems for temperature measurements of the parameters obtained by Van Der Pauw Hall effect technic • HMS5000  • HMS5300 high temp. • HMS5500 very high temp.
Metal bond Dicing blade hubtype serie
LMxx
Metal bond Dicing blade hubtype serie
  • Outside diameter : 2.187 Inch
  • Grit size : 0.5 to 150 Inch

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices. Ready to mount on the dicing machine ( hubtype models)Available in various thicknesses / exposures Diamond grit sizes range adapted to all dicing applications ...

Wafer film frame used for dicing wafer-substrate
FF-xx
Wafer film frame used for dicing wafer-substrate
  • Wafer size : 4, 6, 8, 12 Inch
  • Material : Stainless Steel, Aluminium, plastic

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12") Standard material Stainless steel (alu optional)Sizes and shapes adapted to the dicing equipment, Plastic models available for shipping purposes ...

Hubless resin dicing blades
LRxx
Hubless resin dicing blades
  • Outside diameter : 2-2.187-2.25-3 Inch
  • Grit size : 0.5 to 150 Inch

Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above. Hubless type, mount inside a flange separately supplied and interchangeable after useVariety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicingChoice of bond hardnesses to favorize lifetime or qualit...

Standard Dicing Tape
F07-xx
Standard Dicing Tape
  • Width : 25 to >450 mm
  • Adhesion force on Si : 70@30' 135@24hr g/25mm
  • Thickness : 80 mm

Medium adhesion forcePVC expandable base with acrylic adhesiveNo silicone (contaminants-free)Packaged in roll...

Flange for hubless dicing blades
MW-FL
Flange for hubless dicing blades
  • Outside diameter : 50 to 116 Inch
  • Material : Stainless Steel, Titanium

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond. Material stainless steel or TitaniumFor blades up to 60 mm diameterThe flange OD determines the blade exposureA dismounting tool (separately supplied) is needed to disassemble the flange ...

Standard Dicing Tape Medium-High Tackiness
F08-xx
Standard Dicing Tape Medium-High Tackiness
  • Width : 25 to >450 mm
  • Adhesion force on Si : 95@30' 170@24hr g/25mm
  • Thickness : 80 mm

Medium-High adhesion forcePVC expandable base with acrylic adhesiveNo silicone (contaminants-free)Packaged in roll ...

Dicing machine for wafers / substrates
NDS200
Dicing machine for wafers / substrates
  • Wafers & Substrates diameter : 200 max Inch
  • Application : Si, GaAs, ceramic, glass

The NDS200 is perfectly adapted to research laboratories and small etamp; Medium production for dicing of thin semiconductor and related materials : Si, GaAs, Linb0", LitAO3...And hard materials glass, ceramic, quartz... Accept dicing blades both "hubtype" or "hubless" style up to 3" diameterProcess parameters are inserted with a built in computerMovement control by joystick for non standard appl...

Standard Dicing Tape low tackiness
F09-xx
Standard Dicing Tape low tackiness
  • Width : 25 to >450 mm
  • Adhesion force on Si : 38@30' 68@24hr g/25mm
  • Thickness : 80 mm

Low adhesion forcePVC expandable base with acrylic adhesiveNo silicone (contaminants-free)Packaged in roll ...

Standard Thick Dicing Tape
F04-xx
Standard Thick Dicing Tape
  • Width : 25 to >450 mm
  • Adhesion force on Si : 90@30' 170@24hr g/25mm
  • Thickness : 125 mm

Medium-high adhesion forcePVC expandable base with acrylic adhesiveNo silicone added (Contaminants-free)Packaged in roll ...

Standard Dicing Tape
F05-xx
Standard Dicing Tape
  • Width : 25 to >450 mm
  • Adhesion force on Si : 90@30' 170@24hr g/25mm
  • Thickness : 125 mm

Medium adhesion forcePVC expandable base with acrylic adhesiveNo silicone added (Contaminants-free)Packaged in roll ...

UV Dicing Tape
F20-xx
UV Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 375@30' 308@24hr g/25mm
  • Thickness : 95 mm

PVC based film with UV sensitive adhesiveGood and homogeneous expansion after dicing in order to separate the dies for a safe pickingThe UV features alllow a high adhesion while dicing and a low adhesion after UV curing for pickingBacking layerPackaged in roll hermetic packing (metallized sleeve) ...

UV Antistatic Dicing Tape
F42-xx
UV Antistatic Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 300@30' 550@24hr g/25mm
  • Thickness : 98 mm

Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.The tape has an antistatic layer which dissipates the negative charge build-upThe UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick upPackaged in roll hermetic packing (metallized sleeve) ...

UV Antistatic Dicing Tape
F43-xx
UV Antistatic Dicing Tape
  • Width : 25 to >450 mm
  • Adhesion force on Si before UV : 890@30' 1042@24hr g/25mm
  • Thickness : 168 mm

Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.The tape has an antistatic layer which dissipates the negative charge build-upThe UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick upPackaged in roll hermetic packing (metallized sleeve)...

UV Antistatic Dicing Tape
F44-xx
UV Antistatic Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 350@30' 650@24hr g/25mm
  • Thickness : 268 mm

Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.The tape has an antistatic layer which dissipates the negative charge build-upThe UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick upPackaged in roll hermetic packing (metallized sleeve) ...

High tack UV tape
F27-xx
High tack UV tape
  • Lenght : 100 m
  • Adhesion force on Si before UV : 2080@30' 2160@24hr g/25mm
  • Thickness : 175 mm

PolyOléfine based with acrylic adhesive and PET backing layerThe UV sensitive adhesive offers a high adhesion force during dicing turning very low after UV cure ideal for dies pick upPVC corePackaged in roll hermetic packing (metallized sleeve) ...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171