Microworld offers various useful solutions for Back-End processes for manufacturing a semiconductor.
Whether it is for printed circuit printing using conductive ink, cutting the substrate or making a metallic connection between the component and its PCB, there is equipment that meets each of its needs.
- Wafer film frame laminator machine
- Tape expander machine before pick & place
- UV curing machines
- Scribers for laser cleavage
- Pick & Place machines (Die Bonder)
- Wire Bonder
- Nano-printing machines (via conductive ink, thermoplastic etc.)
- Accessories and consumables (UV film, frame, rings, cutting blades, etc.)
