BACK-END PROCESSING

Microworld offers various equipment useful for Back-end processes, from the preparation of wafer dicing to wire bonding.

- Film frame mounting machines before dicing
- Expansion machines for sorting
- UV curing machines
- Scribers for laser cleavage
- Die sorting machines
- Wire bonding machines before encapsulation
- Accessories and consumables (UV tape, frame, rings, dicing blades ...)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171