Microworld offers various solutions useful for Back-End semiconductor manufacturing processes.
Once the component has been produced and tested, several process steps follow to dice, isolate, package and connect the chip in its electronic environment.
Whether it is for printed circuit design using conductive ink, substrate dicing or the creation of a metal connection between the component and its PCB, there is equipment that meets each of its needs.
Equipment:
• Wafer film frame mounter
• Expansion machines
• UV curing machines
• Scribers for laser strip cleaving
• Pick & Place machines (Sorter, Die Bonder)
• Wire Bonder machines
• Printed circuit design machine (via conductive ink, thermoplastic, etc...)
• Accessories and consumables (UV film, frame, rings, dicing blades, etc...)
