The entire Microworld team thanks our Customers and partners. We wish you an excellent year 2023 on all fronts
Business / Expertise
Products
LAYER CHARACTERIZATION
Four point probe systems
Hall effect measurement systems
Non destructive measurement systems
Material analysis systems
Mercury contact probing systems
Hot plate
COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in boards
BACK-END PROCESSING
Wafer film frame laminator machines
Dicing machines
Scriber system
Tape expander machines
UV curing machines
Die Bonder System
Wire Bonder system
Back-end consumables
PROBE TESTING
Probe stations
Test accessories
Test probes
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Hall Effect Measurements and other parameters
Mercury contact probing
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
Application
DICING OF SUBSTRATES
Post Dicing Tape expansion
Post Dicing Tape expansion
As a post-dicing process the expansion will stretch the tape and largely separate the dies for a safe picking. The damages occuring during pick-up to the neighbour dies are eliminated.
NEED MORE INFORMATION ?
UH130
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Semi-automatic die matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300 mm.
- Temperature-controlled heated stage
- 3-inch pneumatic vertical stroke control with speed control
- Upper and lower frame clamp assembly for different size wafers
- Grip ring automatic insertion
FF
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Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").
- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes
AP
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Plastic grip-ring
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.
- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm
