Paul has recently joined our Sales Team as Semiconductor materials and technology specialist, please welcome him on-board
Some New products arriving soon : Thermal conditioning systems for temperature characterisation, 4-Point-Probe with Evolutive customised software…
Next shows events : ERMS Nice France 27-31 September, EuMW European Microwave Week Paris France 1-3 October

Post Dicing Tape expansion

System with constant current source and fixed magnets offering a good compromise price/performance, for ambient temperature test or at 77K (liquid Nitrogen), Measures resistivity, mobility, carriers concentration, Hall effect coefficient...Useful for semiconductive layers characterization, solar cells, compounds...Additional fixed magnets are available
Wafer film frame used for dicing wafer-substrate
FF-xx
Wafer film frame used for dicing wafer-substrate
  • Wafer size : 4, 6, 8, 12 Inch
  • Material : Stainless Steel, Aluminium, plastic

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12") Standard material Stainless steel (alu optional)Sizes and shapes adapted to the dicing equipment, Plastic models available for shipping purposes ...

Plastic Grip-Ring for wafers up to 12
AP-xx
Plastic Grip-Ring for wafers up to 12
  • Wafer size : 4, 6, 8, 12
  • Material : Lexan (ABS)

Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material They can hold the expanded plastic film and the dies largely separated for a safe pickingAvailable for wafers up to 300 mm ...

Semi-automatic Die Matrix expander
UH130-x
Semi-automatic Die Matrix expander
  • Wafers & Substrates diameter : 4, 6, 8, 12 Inch

The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm. Temperature-controlled heated stage3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132Upper and lower clamp assembly for different size wafersIncr...

UV Dicing Tape
F20-xx
UV Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 375@30' 308@24hr g/25mm
  • Thickness : 95 mm

PVC based film with UV sensitive adhesiveGood and homogeneous expansion after dicing in order to separate the dies for a safe pickingThe UV features alllow a high adhesion while dicing and a low adhesion after UV curing for pickingBacking layerPackaged in roll hermetic packing (metallized sleeve) ...

UV Antistatic Dicing Tape
F42-xx
UV Antistatic Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 300@30' 550@24hr g/25mm
  • Thickness : 98 mm

Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.The tape has an antistatic layer which dissipates the negative charge build-upThe UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick upPackaged in roll hermetic packing (metallized sleeve) ...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171