Post Dicing Tape expansion

As a post-dicing process the expansion will stretch the tape and largely separate the dies for a safe picking. The damages occuring during pick-up to the neighbour dies are eliminated.
Semi-automatic Die Matrix expander
Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300mm.

- Temperature-controlled heated stage
- 3-inch pneumatic vertical stroke control with speed control
- Upper and lower frame clamp assembly for different size wafers
- Grip ring automatic insertion
UV dicing tape
UV dicing tape
- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)
UV antistatic dicing tape
UV antistatic dicing tape
- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
Plastic Grip-Ring
Plastic Grip-Ring
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171