You are visiting our web site, thank you, please feel free to contact us should you have any qurery, Microworld Team

Post Dicing Tape expansion

System with constant current source and fixed magnets offering a good compromise price/performance, for ambient temperature test or at 77K (liquid Nitrogen), Measures resistivity, mobility, carriers concentration, Hall effect coefficient...
Useful for semiconductive layers characterization, solar cells, compounds...
Additional fixed magnets are available
Semi-automatic Die Matrix expander
Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm.

• Temperature-controlled heated stage
• 3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132
• Upper and lower clamp assembly for different size wafers
• Increases throughput and yield through gentle die separation
• Emergency Stop with manual clamp
UV Dicing Tape
UV Dicing Tape
• PVC based film with UV sensitive adhesive
• Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
• The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
• Backing layer
• Packaged in roll hermetic packing (metallized sleeve)
UV Antistatic Dicing Tape
UV Antistatic Dicing Tape
• Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
• The tape has an antistatic layer which dissipates the negative charge build-up
• The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
• Packaged in roll hermetic packing (metallized sleeve)
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

• Standard material Stainless steel (alu optional)
• Sizes and shapes adapted to the dicing equipment, 
• Plastic models available for shipping purposes
Plastic Grip-Ring for wafers up to 12
Plastic Grip-Ring for wafers up to 12
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material.

• They can hold the expanded plastic film and the dies largely separated for a safe picking
• Available for wafers up to 300 mm

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171