COVID-19 despite still some limitations, our Sales and Support team is at work, contact us as needed and take care of you

Post Dicing Tape expansion

As a post-dicing process the expansion will stretch the tape and largely separate the dies for a safe picking. The damages occuring during pick-up to the neighbour dies are eliminated.
Semi-automatic Die Matrix expander
Semi-automatic Die Matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die attach operations, adapt to all wafer/film frame up to 300mm.

• Temperature-controlled heated stage
• 3-inch vertical stroke control with speed control, pneumatic UH130 or by stepping motor UH132
• Upper and lower clamp assembly for different size wafers
• Increases throughput and yield through gentle die separation
• Emergency Stop with manual clamp
UV Dicing Tape
UV Dicing Tape
• PVC based film with UV sensitive adhesive
• Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
• The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
• Backing layer
• Packaged in roll hermetic packing (metallized sleeve)
UV Antistatic Dicing Tape
UV Antistatic Dicing Tape
• Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
• The tape has an antistatic layer which dissipates the negative charge build-up
• The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
• Packaged in roll hermetic packing (metallized sleeve)
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

• Standard material Stainless steel (alu optional)
• Sizes and shapes adapted to the dicing equipment, 
• Plastic models available for shipping purposes
Plastic Grip-Ring for wafers up to 12
Plastic Grip-Ring for wafers up to 12
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material.

• They can hold the expanded plastic film and the dies largely separated for a safe picking
• Available for wafers up to 300 mm

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171