6

CM4656" semi-automatic probe station

Semi-automatic probing stations for full wafer electrical characterization.

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- X-Y stage drives by induction motor for high speed and accuracy
- Probecard application available
- High voltage (HV -10kV) and low leakage (fA) measurements
- Tool developed for design validation (R&D) and yield monitoring (production)
8

CM2508" semi-automatic probe station

Semi-automatic probe stations for full wafer electrical characterization up to 8" (200 mm).

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- Probecard application available
- Temperature characterization up to +600°C
- High voltage (HV - 10kV) and low leakage (fA) measurements
- Tool developed for design validation (R&D) and yield monitoring (production)
- Configuration : up 10 ports DC/Kelvin
- Compatible with high performances ERS chuck (patented air cooling system, temperature from -60°C to +300°C)

MOST POPULAR REFERENCES

CM250 : Version 200 mm
CM350 : Version 300 mm
8

WL250-LE8" HF semi-automatic probe station with local enclosure

Semi-automatic probing stations for full wafer HF electrical characterization.

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- Probecard application available
- Thermal characterization from -60°C to +300°C
- HF measurements up to 110 GHz
- Tool developed for design validation (R&D) and yield monitoring (production)
- Configuration : up 4 ports HF (N, S, E, W) and 4 DC
- Optional local enclosure for EMI shielding and light-tight

MOST POPULAR REFERENCES

WL250 : 200 mm version
WL350 : 300 mm version
WL250-LE : 200 mm with local enclosure
WL350-LE : 300 mm with local enclosure
12

WL350-LE12" HF semi-automatic probe station with local enclosure

Semi-automatic probing stations for full wafer HF electrical characterization.

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- Probecard application available
- Thermal characterization from -60°C to +300°C
- HF measurements up to 110 GHz
- Tool developed for design validation (R&D) and yield monitoring (production)
- Configuration : up 4 ports HF (N, S, E, W) and 4 DC
- Optional local enclosure for EMI shielding and light-tight

MOST POPULAR REFERENCES

WL250 : 200 mm version
WL350 : 300 mm version
WL250-LE : 200 mm with local enclosure
WL350-LE : 300 mm with local enclosure
8

WL2508" HF semi-automatic probe station

Semi-automatic probing stations for full wafer HF electrical characterization.

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- Probecard application available
- Thermal characterization from -60°C to +300°C
- HF measurements up to 110 GHz
- Tool developed for design validation (R&D) and yield monitoring (production)
- Configuration : up 4 ports HF (N, S, E, W) and 4 DC
- Optional local enclosure for EMI shielding and light-tight

MOST POPULAR REFERENCES

WL250 : 200 mm version
WL350 : 300 mm version
WL250-LE : 200 mm with local enclosure
WL350-LE : 300 mm with local enclosure
12

CM35012" semi-automatic probe station

Semi-automatic probe stations for full wafer electrical characterization up to 12" (300 mm).

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- Probecard application available
- Temperature characterization up to +600°C
- High voltage (HV - 10kV) and low leakage (fA) measurements
- Tool developed for design validation (R&D) and yield monitoring (production)
- Configuration : up 10 ports DC/Kelvin
- Compatible with high performances ERS chuck (patented air cooling system, temperature from -60°C to +300°C)

MOST POPULAR REFERENCES

CM250 : Version 200 mm
CM350 : Version 300 mm
ABOUT OUR Semi-automatic probe stations
The semi-automatic probers will allow the user to perform a complete testing on a partial or entire wafer, automatically and very repeatably
• A pattern recognition software (New) eliminate the false positioning by recognizing exactly where the tips need to land
• The stations are available in several configurations depending on the wafer size and automation needed
• High frequency RF models 
• Control of motion by external GPIB or built in software
• Variety of accessories and options matching all specific applications, temperature measurements, FemtoAmp, high power...
• A perfect choice for die characterization, design validation, failure analysis and low-medium production (manual wafer loading)
For technical and commercial information, quote, ordering or request of visit by our representative.
+33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171