COMPONENTS TESTÌNG AND BURN INTest and Burn in sockets

SOKBGAStandard test socket for BGA packages

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer

SOKQFNStandard test socket for QFN packages

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKLCCTest socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)

Burn in and Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

• Spacing between pads (pitch) depending on case, temperature, options
• Several socket designs of all styles in ClamShell, Open Top, screw fixing...with type C contacts, balls, pogo pins...
• Double height contact options
• Easy installation and unloading of the component
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKCUSTCustomized Test Socket

Burn in and Test socket specifically developped according to Customer SpecSheet for a particular component and associated test environment.

• Applications : HF, high power, failure analysis on packaged devices, new packages testing...
• Fabrication in two steps : Drawing release (2 weeks) - Approval - Fabrication (typical 6 weeks)
• This socket will totally match your application as being developed for it

SOICTest socket for SOIC device

SOIC Test sockets (Burn-in).
All package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Designs ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DFNTest socket for DFN device

Burn in and Test sockets for all DFN package styles.
Newest or oldest, available from existing design, or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SCTest socket for SC device

Burn in : SC Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SODTest socket for SOD device

SOD Test sockets and Burn-in for all package styles : newest, oldest, standard design, semi-custom, full custom..

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SSOPTest socket for SSOP device

Burn in and Test sockets for all SSOP package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOTTest socket for SOT device

Supports de test pour tous boitiers SOT, développements existant ou personnalisés selon boitier et spécifications de test.

• Espacement entre plots (pitch) à partir de 0,22 mm, temperature
• Dessinés pour accommoder les variations d'épaisseur de boitier dans une large mesure
• Plus de 1300 Designs ClamShell, Open Top, serrage par vis...
• Nous envoyer les détails de votre composant (schéma dimensionnel) pour vérifier la disponibilité et obtenir une offre

DDPAKTest socket for DDPAK device

DDPAK Test sockets package (Burn-in).
All styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

TOTest socket for TO device

Burn in and Test sockets for all TO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Pitches start at 0.22mm, temperature
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DOTest socket for DO device

Burn in and Test sockets for all DO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SMDTest socket for SMD device

Burn in and Test sockets for all SMD package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

FPTest socket for FP device

Burn in and Test sockets for all FP package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

ABOUT OUR Test and Burn in sockets

Our range of supports covers all needs, whatever the component and the intended application.
In particular, supports for the most recent boxes (QFN, BGA...), and older ones (TO, flat pack, axial-radiall...)

Specifications:

• Standard test temperature up to 175°C or higher (high temp. option up to 250°C)
• SMD surface mounting or PCB drilling
• Closing by pivoting lid (clam-shell) or by pressure (open-top), or by screw lid
• More than 4500 diagrams developed over the requests including 1300+ QFN, 1400+ SMD's...
• Options Kelvin, non-magnetic, humidity resistant, high temperature, autoclave...
• Contact by spring blade, friction, balls, spring spikes...

Standard tests, high temperature, high frequency, power, Special developments for specific non-standard components in semi-custom or completely customizable version...

Applications:

- Custom tests
- Nanotechnology
- Robotics
- Automotive
- Aerospace
- Aeronautics