BACK-END PROCESSINGBack-end consumablesDiamond dicing blades

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3" hubless resin dicing blades

LR33" hubless resin dicing blades

Resin diamond blades are specifically designed for high-precision cutting applications in the semiconductor industry. Thanks to their optimized structure, they offer a smooth and controlled cutting action, minimizing mechanical stress on components while ensuring excellent surface finish quality.

Particularly suited to fragile materials and thin wafers, they produce clean cuts with minimal chipping and micro-cracks.

The resin bond ensures constant renewal of the diamond grains during the cutting operation, guaranteeing an excellent balance between performance, surface finish quality, and wear control. This technology is especially recommended when the quality of the cutting edge and component protection are critical requirements.

Advantages:

• Excellent surface quality after cutting
• Significant reduction in chipping and edge defects
• Low mechanical stress on sensitive substrates
• Precise and consistent cutting
• Wide range of diamond grit sizes
• Optimized production throughput
• Compatible with leading diking equipment on the market

Applications:

- Silicon (Si) wafers
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Technical glass and ultra-thin glass
- Advanced ceramics
- Electronic substrates
- Optoelectronic components
- MEMS, sensors, and power devices
- Technology dedicated to precision
Metal Dicing blade hubtype serie K&S

LMKSMetal Dicing blade hubtype serie K&S

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures 
- Diamond grit sizes range adapted to all dicing applications
Metal Dicing blade hubtype

LMFIMetal Dicing blade hubtype

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures 
- Diamond grit sizes range adapted to all dicing applications
2" hubless resin dicing blades

LR22" hubless resin dicing blades

Resin diamond blades are specifically designed for high-precision cutting applications in the semiconductor industry. Thanks to their optimized structure, they offer a smooth and controlled cutting action, minimizing mechanical stress on components while ensuring excellent surface finish quality.

Particularly suited to fragile materials and thin wafers, they produce clean cuts with minimal chipping and micro-cracks.

The resin bond ensures constant renewal of the diamond grains during the cutting operation, guaranteeing an excellent balance between performance, surface finish quality, and wear control. This technology is especially recommended when the quality of the cutting edge and component protection are critical requirements.

Advantages:

• Excellent surface quality after cutting
• Significant reduction in chipping and edge defects
• Low mechanical stress on sensitive substrates
• Precise and consistent cutting
• Wide range of diamond grit sizes
• Optimized production throughput
• Compatible with leading diking equipment on the market

Applications:

- Silicon (Si) wafers
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Technical glass and ultra-thin glass
- Advanced ceramics
- Electronic substrates
- Optoelectronic components
- MEMS, sensors, and power devices
- Technology dedicated to precision
Flange for hubless dicing blades

MW-FLFlange for hubless dicing blades

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

- Material stainless steel or Titanium
- For blades up to 60 mm diameter
- The flange OD determines the blade exposure
- A dismounting tool (separately supplied) is needed to disassemble the flange

ABOUT OUR Diamond dicing blades
We offer a complete range of cutting blades specifically designed to meet the demands of the semiconductor industry. Thanks to their precision, stability, and excellent cut quality, our solutions guarantee optimal throughput and reduced material waste during dicing operations.

Metal Blades:

Metal blades are particularly well-suited to applications requiring high cutting precision and excellent dimensional stability. Their metallic structure provides high rigidity, allowing for very tight tolerances, even on the most demanding materials.

Advantages:

• High cutting precision
• Excellent geometric stability
• Long service life
• Reduced chipping and surface defects
• Suitable for silicon, ceramic, glass, and composite wafers

Resin Blades:

Resin blades are designed for delicate applications requiring smooth and controlled cutting. Their resin bond ensures an excellent finish while minimizing mechanical stress on sensitive components.

Advantages:

• Smooth cutting and low stress generation
• Excellent surface finish
• Reduced chipping and microcracks
• Optimal performance on brittle materials
• Ideal for advanced semiconductors, thin substrates, and high-value electronic components
• A solution tailored to every application

Our experts will guide you in selecting the blade best suited to your manufacturing processes, taking into account material characteristics, cutting parameters, and quality requirements. Our goal is to provide you with reliable solutions that improve your productivity while guaranteeing impeccable cutting quality.
For technical and commercial information, quote, ordering or request of visit by our representative.
+33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171