BACK-END PROCESSINGBack-end consumablesDiamond dicing blades

LMKSMetal Dicing blade hubtype serie K&S

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures
- Diamond grit sizes range adapted to all dicing applications

LMFIMetal Dicing blade hubtype

LR2-3Hubless resin dicing blades

Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above.

- Hubless type, mount inside a flange separately supplied and interchangeable after use
- Variety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")
- The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicing
- Choice of bond hardnesses to favorize lifetime or quality of cut

MW-FLFlange for hubless dicing blades

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

- Material stainless steel or Titanium
- For blades up to 60 mm diameter
- The flange OD determines the blade exposure
- A dismounting tool (separately supplied) is needed to disassemble the flange

ABOUT OUR Diamond dicing blades

Choice of diamond dicing wheels for thin materials, Silicon, glass, ceramic...
• Metal bond for semiconductor materials dicing and resin bond for hard and brittle materials
• Standard low cost models or specific for dicing exotic materials
• Free advices of recommended blades and starting parameters
• Microworld has been providing dicing consumable since 1991

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171