Plastic grip-rings

CONSUMABLE FOR DICING PROCESSES - Plastic grip-rings

Typically used following the tape expansion process, the grip-rings allow maintaining the tape well stretched for die-separation
• Available for all wafer size up to 12"
• Robust material Lexan for both inner and outer ring
• Adapt on our UH130-132 expanders to tense the tape and separate dies
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Plastic Grip-Ring
Plastic Grip-Ring
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171