Wafer film frame laminator machines

BACK-END PROCESSING - Wafer film frame laminator machines

Robust and easy to use equipment, perfectly reproducible operation to glue the wafer on the film and cut the film on the frame.

- Available in 200 or 300mm version
- Manual (UH114) or semi-automatic (UH115)
- Hot chuck
- Options: protective film rolling up, antistatic bar...
UH114
Manual wafer / frame film mounter
Manual wafer / frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

- Tape uniform tension
- Temperature controlled chuck
- Built-in circular cutter for cutting film on film frame, built-in end cutter for film separation
- Operates with backed or non backed films (UV tape)
- Accept metallic and plastic frames
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
UH115
Semi-automatic wafer / frame film mounter
Semi-automatic wafer / frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171