The entire Microworld team thanks our Customers and partners. We wish you an excellent year 2023 on all fronts
Business / Expertise
Products
LAYER CHARACTERIZATION
Four point probe systems
Hall effect measurement systems
Non destructive measurement systems
Material analysis systems
Mercury contact probing systems
Hot plate
COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in boards
BACK-END PROCESSING
Wafer film frame laminator machines
Dicing machines
Scriber system
Tape expander machines
UV curing machines
Die Bonder System
Wire Bonder system
Back-end consumables
PROBE TESTING
Probe stations
Test accessories
Test probes
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Hall Effect Measurements and other parameters
Mercury contact probing
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
Wafer film frame laminator machines
BACK-END PROCESSING
Wafer film frame laminator machines
BACK-END PROCESSING - Wafer film frame laminator machines
Robust and easy to use equipment, perfectly reproducible operation to glue the wafer on the film and cut the film on the frame.
- Available in 200 or 300mm version
- Manual (UH114) or semi-automatic (UH115)
- Hot chuck
- Options: protective film rolling up, antistatic bar...
NEED MORE INFORMATION ?
UH114
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Manual wafer / frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.
- Tape uniform tension
- Temperature controlled chuck
- Built-in circular cutter for cutting film on film frame, built-in end cutter for film separation
- Operates with backed or non backed films (UV tape)
- Accept metallic and plastic frames
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
UH115
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Semi-automatic wafer / frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".
- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
