PROBE TESTING - Probe stations

Our test equipment will allow you to meet all standard and technical specifications. Whether the application, device characterization, de-bug, failure analysis or industrial process development and R&D. Manual and semi-automatic probe stations are both versatile and precise to meet the requirements of microelectronics.

The manual probers can test all types of single die or several dies on an entire or partial wafer up to 300 mm
• Manual motion of the vacuum chuck and of the microscope
• Basic low-cost model, or economical multi-applications or submicronic high precision
• Specific configurations for demanding tests : low current, high power...
• Configurable and upgradable with choice of options : Thermal chuck, triaxial connections, isolating box (dark box)...
• Standard frequency DC or high frequency (RF)

Economical probe stations for single chip or wafer up to 200 mm, for geometry of pads or lines of few microns
• Standard manual DC versions or high frequency microwave model
• The microscope post accepts bino type (basic) or high power type (turret multi-objectives on SS160 only)
• Up to 10 positioners (upon model) with magnetic or vacuum base
• Optional thermal chuck for temperature applications
• Range of accessories and options

A range of submicronic probe stations of high precision and accuracy for tests on small pads or very small internal nodes. Accepts from individual die to partial wafer or entire wafer up to 12"
• Solid base providing a low level of noise once seated on a vibration table
• Several configurations of chuck, standard, triax, thermally controlled...
• Can accept high-end positioners for an optimum accuracy
• Custom configurations upon specsheet

The semi-automatic probers will allow the user to perform a complete testing on a partial or entire wafer, automatically and very repeatably
• A pattern recognition software (New) eliminate the false positioning by recognizing exactly where the tips need to land
• The stations are available in several configurations depending on the wafer size and automation needed
• High frequency RF models 
• Control of motion by external GPIB or built in software
• Variety of accessories and options matching all specific applications, temperature measurements, FemtoAmp, high power...
• A perfect choice for die characterization, design validation, failure analysis and low-medium production (manual wafer loading)

This equipment is designed for probing under temperature on sample up to 4".
• Variable temperature 80k to 573k
• Vacuum capable down to 8.10-3 Torr
• Gas injection possible
• Accepts up to 4 positioners