Despite difficulties with the COVID-19 situation, our whole team remains available !
Business / Expertise
Products
PROBE STATIONS
Analytical Manual Probe Stations
Semi-automatic Probers
PowerPro Probe stations
Thermal probe stations
ACCESSORIES FOR PROBE STATIONS
Microscopes & Optics
Micropositioners
Probe holders for micropositioners
Antivibration Tables
Isolating boxes
Temperature controllers - Hot/Cold chucks
Instrument Control Softwares
Other (connecting, vacuum, specific chucks...)
Mesurement devices
TEST PROBES
Passive probe tips
Coxial & Kelvin probes
Active probes
RF and mmW probes
High Power Probes
Accessories (PS, cleaning, calibrating)
EQUIPMENT FOR THIN LAYER CHARACTERIZATION
Hot plate
Four Point Probe systems
Four Point Probe heads
Hall effect measurement systems
Equipment's for Mercury contact Probing
RTP (Rapid Thermal Processing)
PRODUCTS FOR COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in Ovens & Boards
EQUIPMENT FOR DICING AND RELATED PROCESSES
Dicing machines
Wafer frame laminators
Tape expanders
UV curing systems
Die Bonder System
Wire Bonder system
Scriber system
CONSUMABLE FOR DICING PROCESSES
Adhesive tapes
Diamond dicing blades
Wafer-film-frames
Plastic grip-rings
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Hall Effect Measurements and other parameters
Mercury contact probing
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
Scriber system
EQUIPMENT FOR DICING AND RELATED PROCESSES
Scriber system
EQUIPMENT FOR DICING AND RELATED PROCESSES - Scriber system
Those systems allow scribing to cut component.
This scribe is following substrate crystal and is better than cutting blade which will damage die edges.
NEED MORE INFORMATION ?
S200
Voir la Fiche Produit
Scriber system
Scribe Model 200 is easy to use for scribing components on up to 8'' wafer.
Robust, vibration free the scribe 200 unit is immediately operational, with minimum training.
Vertical targeting is carried out with a video camera, Monitor display includes an electronic crosshair.
A LCD screen allows parameters display and selected through programming wheel.