EQUIPMENT FOR DICING AND RELATED PROCESSES - Scriber system

Those systems allow scribing to cut component.
This scribe is following substrate crystal and is better than cutting blade which will damage die edges.

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S200

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Scriber system

Scribe Model 200 is easy to use for scribing components on up to 8'' wafer.

Robust, vibration free the scribe 200 unit is immediately operational, with minimum training.
Vertical targeting is carried out with a video camera, Monitor display includes an electronic crosshair.
A LCD screen allows parameters display and selected through programming wheel.

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

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PROBE STATIONS

ACCESSORIES FOR PROBE STATIONS

TEST PROBES

EQUIPMENT FOR THIN LAYER CHARACTERIZATION

PRODUCTS FOR COMPONENTS TESTÌNG AND BURN IN

EQUIPMENT FOR DICING AND RELATED PROCESSES

CONSUMABLE FOR DICING PROCESSES

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL

ELECTRICAL TESTS UNDER NEEDLES

TEST ON PACKAGED DEVICES

DICING OF SUBSTRATES

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171