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Business / Expertise
Products
LAYER CHARACTERIZATION
Four point probe systems
Hall effect measurement systems
Non destructive measurement systems
Material analysis systems
Mercury contact probing systems
Hot plate
COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in boards
BACK-END PROCESSING
Wafer film frame laminator machines
Dicing machines
Scriber system
Tape expander machines
UV curing machines
Die Bonder System
Wire Bonder system
Back-end consumables
PROBE TESTING
Probe stations
Test accessories
Test probes
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Hall Effect Measurements and other parameters
Mercury contact probing
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
Scriber system
BACK-END PROCESSING
Scriber system
BACK-END PROCESSING - Scriber system
Those systems allow scribing to cut component.
This scribe is following substrate crystal and is better than cutting blade which will damage die edges.
NEED MORE INFORMATION ?
S200
Voir la Fiche Produit
Scriber system
Scribe Model 200 is easy to use for scribing components on up to 8'' wafer.
Robust, vibration free the scribe 200 unit is immediately operational, with minimum training.
Vertical targeting is carried out with a video camera, Monitor display includes an electronic crosshair.
A LCD screen allows parameters display and selected through programming wheel.
