EQUIPMENT FOR DICING AND RELATED PROCESSES - Dicing machines

Designed for semiconductor substrates dicing, Silicon and associated materials, partial or entire wafers, hybrid substrates, ceramic, glass, all thin materials of maximum thickness 2 to 3 mm
• Models for wafers up to 200 mm with manual loading/unloading
• Operate from built in software or by joystick
• Perfect for laboratories and small productions