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Business / Expertise
Products
LAYER CHARACTERIZATION
Four point probe systems
Hall effect measurement systems
Non destructive measurement systems
Material analysis systems
Mercury contact probing systems
Hot plate
COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in boards
BACK-END PROCESSING
Wafer film frame laminator machines
Dicing machines
Scriber system
Tape expander machines
UV curing machines
Die Bonder System
Wire Bonder system
Back-end consumables
PROBE TESTING
Probe stations
Test accessories
Test probes
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Hall Effect Measurements and other parameters
Mercury contact probing
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
Dicing machines
BACK-END PROCESSING
Dicing machines
BACK-END PROCESSING - Dicing machines
Intended for cutting semiconductor substrates, silicon wafers or other materials, hybrid substrates, ceramics, glass...
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