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Dicing machines

EQUIPMENT FOR DICING AND RELATED PROCESSESDicing machines

EQUIPMENT FOR DICING AND RELATED PROCESSES - Dicing machines

Designed for semiconductor substrates dicing, Silicon and associated materials, partial or entire wafers, hybrid substrates, ceramic, glass, all thin materials of maximum thickness 2 to 3 mm
• Models for wafers up to 200 mm with manual loading/unloading
• Operate from built in software or by joystick
• Perfect for laboratories and small productions
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For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617
Products Categories

PROBE STATIONS

ACCESSORIES FOR PROBE STATIONS

TEST PROBES

EQUIPMENT FOR THIN LAYER CHARACTERIZATION

PRODUCTS FOR COMPONENTS TESTÌNG AND BURN IN

EQUIPMENT FOR DICING AND RELATED PROCESSES

CONSUMABLE FOR DICING PROCESSES

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL

ELECTRICAL TESTS UNDER NEEDLES

TEST ON PACKAGED DEVICES

DICING OF SUBSTRATES

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171