Paul has recently joined our Sales Team as Semiconductor materials and technology specialist, please welcome him on-board

Our Products family N°1 : Equipment’s and accessories for semiconductor materials electrical characterization

Some New products arriving soon : Thermal conditioning systems for temperature characterisation, 4-Point-Probe with Evolutive customised software…

Next shows events : ERMS Nice France 27-31 September, EuMW European Microwave Week Paris France 1-3 October

CatalogEQUIPMENT FOR DICING AND RELATED PROCESSES Dicing machines

Dicing machines

Designed for semiconductor substrates dicing, Silicon and associated materials, partial or entire wafers, hybrid substrates, ceramic, glass, all thin materials of maximum thickness 2 to 3 mm • Models for wafers up to 200 mm with manual loading/unloading • Operate from built in software or by joystick • Perfect for laboratories and small productions

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NDS200

Dicing machine for wafers / substrates

Wafers & Substrates diameter : 200 max Inch
Application : Si, GaAs, ceramic, glass

The NDS200 is perfectly adapted to research laboratories and small etamp; Medium production for dicing of thin semiconductor and related materials : Si, GaAs, Linb0", LitAO3...And hard materials glass, ceramic, quartz... Accept dicing blades both "hubtype" or "hubless" style up to 3" diameterProcess parameters are inserted with a built in computerMovement control by joystick for non standard appl...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

Products Categories

PROBE STATIONS

ACCESSORIES FOR PROBE STATIONS

TEST PROBES

EQUIPMENT FOR THIN LAYER CHARACTERIZATION

PRODUCTS FOR COMPONENTS TESTÌNG AND BURN IN

EQUIPMENT FOR DICING AND RELATED PROCESSES

CONSUMABLE FOR DICING PROCESSES

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL