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Dicing machines

EQUIPMENT FOR DICING AND RELATED PROCESSES - Dicing machines

Designed for semiconductor substrates dicing, Silicon and associated materials, partial or entire wafers, hybrid substrates, ceramic, glass, all thin materials of maximum thickness 2 to 3 mm
• Models for wafers up to 200 mm with manual loading/unloading
• Operate from built in software or by joystick
• Perfect for laboratories and small productions
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171