Business / Expertise
Products
LAYER CHARACTERIZATION
Four point probe systems
Manual systems
Semi-automatic systems
Handheld systems
Four point probe heads
Calibration wafers
Hall effect measurement systems
Standard systems
Special systems
Sample holders
Non destructive measurement systems
Manuals systems
Semi-automatic systems
Handheld systems
Material analysis systems
Optical profilometers
Mechanical testers
Tribometers
Mercury contact probing systems
Hot plate
RTP (Rapid Thermal Processing)
PROBE TESTING
Probe stations
Manual probe stations
Semi-automatic probe stations
Compact thermal probe stations
Test accessories
Dark boxes
Cameras
Specific chucks
Thermal chucks
Measurement softwares
Micropositioners
Microscopes
Probe holders
Antivibration Tables
Test probes
Passive probe tips
RF and mmW probes
Coaxial and Kelvin probes
Multicontact probes
Active probes
Probecards
Accessories (PS, cleaning, calibrating)
BACK-END PROCESSING
Wafer film frame laminator machines
Dicing machines
Scriber system
Tape expander machines
UV curing machines
Die Bonder System
Wire Bonder system
Nano-printing machines
Back-end consumables
Adhesive tapes
Diamond dicing blades
Wafer film frames
Plastic grip rings
COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in boards
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Manual 1 Point or few Points
Automatic with Mapping
Hall Effect Measurements and other parameters
Mercury contact probing
Value for low K & High K
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
BACK-END PROCESSING
Dicing machines
NEED MORE INFORMATION ?
ABOUT OUR Dicing machines
Intended for cutting semiconductor substrates, silicon wafers or other materials, hybrid substrates, ceramics, glass...
