DICING OF SUBSTRATES

The dicing will consist in the following processes typically called "back-end"
• Safely separate the dies after processing
• Or mechanically reduce the size of the substrates on which are engraved the electronic circuits
• Insure that each die will not be damaged after separation during the pick-up
The range of equipment's used is very specific for the purpose and includes accessories that will allow the safe processes and the quality insurance.
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171