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Burn in of components for reliability testing

The burn in operations will heat up the devices up to 125°c or 150 or higher while stimulating its electrical functioning and eliminate the early failures or border-range specs. In view of this Microworld propose two important accessories for the burn in
• Test sockets specifically adapted for your device and your test temperatures
• Burn in boards designed to fit your ovens and respond to your electrical and thermal burn in requirements
SOKQFN
Standard test socket for QFN packages
Standard test socket for QFN packages
Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer
SOKBGA
Standard test socket for BGA packages
Standard test socket for BGA packages
Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer
SOKLCC
Test socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)
Test socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)
Burn in and Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

• Pitches upon package drawing, temperature, options
• Low-Profile and small footprint design,
• Over 5000 designs, ClamShell, Open Top, Screw-Lid, C type contacts, spring contact, balls...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer


SOKCUST
Customized Test Socket
Customized Test Socket
Burn in and Test socket specifically developped according to Customer SpecSheet for a particular component and associated test environment.

• Applications : HF, high power, failure analysis on packaged devices, new packages testing...
• Fabrication in two steps : Drawing release (2 weeks) - Approval - Fabrication (typical 6 weeks)
• This socket will totally match your application as being developed for it
BIB
Burn-in boards
Burn-in boards
Designed and fabricated upon Customer Specsheet, single or double-sided, multi-layers, available for all format types of burn in ovens (humidity, temperature, hast).
• Designed for all components style, various pcb options (FR4, polyimide...)
• Electric additional circuitry included (biasing...) if needed
• Designed for standing standard and/or severe thermal environments (Dry, Humidity, Hast test...)
• Fully customized designs for all applications, power dissipation, high frequency, prototyping...


OneBox
OneBox Burn in Oven
OneBox Burn in Oven
Vertical Airflow Oven for Dynamic or static burn-in of semiconductors or other microelectronic devices.

• Has been designed around a standard 19 inch rack environment providing for minimal equipment footprint
• Minimal complexity and maximum flexibility through the use of simple controls and optional computer controls
• Automatic controls adjust airflow for necessary heat removal during operation
• Options : Chart recorder, Nitrogen flow, extended temp use, Computer control...
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171