TEST ON PACKAGED DEVICESBurn in of components for reliability testing

SOKBGAStandard test socket for BGA packages

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer

SOKQFNStandard test socket for QFN packages

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKLCCTest socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)

Burn in and Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

• Spacing between pads (pitch) depending on case, temperature, options
• Several socket designs of all styles in ClamShell, Open Top, screw fixing...with type C contacts, balls, pogo pins...
• Double height contact options
• Easy installation and unloading of the component
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKCUSTCustomized Test Socket

Burn in and Test socket specifically developped according to Customer SpecSheet for a particular component and associated test environment.

• Applications : HF, high power, failure analysis on packaged devices, new packages testing...
• Fabrication in two steps : Drawing release (2 weeks) - Approval - Fabrication (typical 6 weeks)
• This socket will totally match your application as being developed for it

BIBBurn-in boards

Designed and fabricated upon Customer Specsheet, single or double-sided, multi-layers, available for all format types of burn in ovens (humidity, temperature, hast).
• Designed for all components style, various pcb options (FR4, polyimide...)
• Electric additional circuitry included (biasing...) if needed
• Designed for standing standard and/or severe thermal environments (Dry, Humidity, Hast test...)
• Fully customized designs for all applications, power dissipation, high frequency, prototyping...

ABOUT : Burn in of components for reliability testing

The burn in operations will heat up the devices up to 125°c or 150 or higher while stimulating its electrical functioning and eliminate the early failures or border-range specs. In view of this Microworld propose two important accessories for the burn in
• Test sockets specifically adapted for your device and your test temperatures
• Burn in boards designed to fit your ovens and respond to your electrical and thermal burn in requirements