UH130Semi-automatic die matrix expander
The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300 mm.
- Temperature-controlled heated stage
- 3-inch pneumatic vertical stroke control with speed control
- Upper and lower frame clamp assembly for different size wafers
- Grip ring automatic insertion
- Temperature-controlled heated stage
- 3-inch pneumatic vertical stroke control with speed control
- Upper and lower frame clamp assembly for different size wafers
- Grip ring automatic insertion