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Business / Expertise
Products
LAYER CHARACTERIZATION
Four point probe systems
Hall effect measurement systems
Non destructive measurement systems
Material analysis systems
Mercury contact probing systems
Hot plate
COMPONENTS TESTÌNG AND BURN IN
Test and Burn in sockets
Burn in boards
BACK-END PROCESSING
Wafer film frame laminator machines
Dicing machines
Scriber system
Tape expander machines
UV curing machines
Die Bonder System
Wire Bonder system
Back-end consumables
PROBE TESTING
Probe stations
Test accessories
Test probes
Applications
CHARACTERIZATION OF ELECTRONIC LAYERS
4-Point Probing
Hall Effect Measurements and other parameters
Mercury contact probing
Growing layers by RTP (Rapid Thermal Processor)
INSTRUMENTATION CONTROL
Softwares for controlling Instruments
ELECTRICAL TESTS UNDER NEEDLES
IV / CV Measurements & Failure analysis
Low-Leakage-Current Testing
High Power Probing
HF & Microwave Probing
Probing under Vacuum
Probing with a probecard & Mapping
TEST ON PACKAGED DEVICES
Testing a new packaged component
Burn in of components for reliability testing
Probing a packaged device
Probing on a non flat substrate
DICING OF SUBSTRATES
Laminating Adhesive tape on Wafers and Frames
Post Dicing Tape expansion
Wafers and other materials Dicing
Curing UV tape after dicing
Contact
Wire Bonder system
BACK-END PROCESSING
Wire Bonder system
BACK-END PROCESSING - Wire Bonder system
The WB series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.
They are based on a robust, and reliable mechanical concept, easy to use, flexible, for multiple application
NEED MORE INFORMATION ?
WB200
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Semi-Automatic Wire Bonder
The WB200 series are the new generation of Wire bonders.
Enhanced functionality. Ball, Wedge & Bump.
Full manual Z Step control for prototyping or simple repair.
No mechanical set-up required.
WB100
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Semi automatic Wire-Bonder
The WB-100 series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.
Its flat bench Top size allows easy carriage and also operation.
Since 10 years our WB-100 is a successful established equipment on the worldwide market.
MPT10
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Pull Tester system
The MPT10 fulfils accurate Pull test to evaluate bond quality required for reliable process.
Accessories and appropriated tools are available to test thin bonded wires from 15µm up to 100µm diameter.
- Simple and robust
- Does not require any training to operate
