Wire Bonder system

BACK-END PROCESSINGWire Bonder system

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WB200Semi-Automatic Wire Bonder

The WB200 series are the new generation of Wire bonders.

Enhanced functionality. Ball, Wedge & Bump.
Full manual Z Step control for prototyping or simple repair.
No mechanical set-up required.

WB100Semi automatic Wire-Bonder

The WB-100 series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.

Its flat bench Top size allows easy carriage and also operation.

Since 10 years our WB-100 is a successful established equipment on the worldwide market.

MPT10Pull Tester system

The MPT10 fulfils accurate Pull test to evaluate bond quality required for reliable process.

Accessories and appropriated tools are available to test thin bonded wires from 15µm up to 100µm diameter.
- Simple and robust
- Does not require any training to operate
ABOUT OUR Wire Bonder system
The WB series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.

They are based on a robust, and reliable mechanical concept, easy to use, flexible, for multiple application
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617
Products Categories

LAYER CHARACTERIZATION

COMPONENTS TESTÌNG AND BURN IN

BACK-END PROCESSING

PROBE TESTING

Applications

CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL

ELECTRICAL TESTS UNDER NEEDLES

TEST ON PACKAGED DEVICES

DICING OF SUBSTRATES

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171