Wire Bonder system

EQUIPMENT FOR DICING AND RELATED PROCESSES - Wire Bonder system

The WB series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.

They are based on a robust, and reliable mechanical concept, easy to use, flexible, for multiple application
WB200
Semi-Automatic Wire Bonder
Semi-Automatic Wire Bonder
The WB200 series are the new generation of Wire bonders.

Enhanced functionality. Ball, Wedge & Bump.
Full manual Z Step control for prototyping or simple repair.
No mechanical set-up required.
WB100
Ball and Wedge Bonder system
Ball and Wedge Bonder system
The WB-100 series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.

Its flat bench Top size allows easy carriage and also operation.

Since 10 years our WB-100 is a successful established equipment on the worldwide market.
MPT10
Pull Tester system
Pull Tester system
The MPT10 fulfils accurate Pull test to evaluate bond quality required for reliable process.

Accessories and appropriated tools are available to test thin bonded wires from 15µm up to 100µm diameter.
- Simple and robust
- Does not require any training to operate
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171