Paul has recently joined our Sales Team as Semiconductor materials and technology specialist, please welcome him on-board
Some New products arriving soon : Thermal conditioning systems for temperature characterisation, 4-Point-Probe with Evolutive customised software…
Next shows events : ERMS Nice France 27-31 September, EuMW European Microwave Week Paris France 1-3 October

Laminating Adhesive tape on Wafers and Frames

These systems use a specific technic to extract electrical characteristics from electronic thin layers. The samples for measurement are square contacted on each four side by a spring needle. The Hall effect measurement is used to determine semiconductor parameters such as I-R, I-V graphs, conductivity, carriers concentration, Hall coefficient... • Applicable materials :  Si, SiGe, SiC, GaAs, InGaAs, InP, GaN, TCO(including ITO), AlZnO, FeCdTe, ZnO... And all semiconductors (N/P-type) • Measuring samples size : De 5X5 mm à 25x25 mm, épaisseur < 2 mm • Fixed magnets of different values • Cold T° starting at 77K, ambient or high temperatures up to 770K • Optional Continuous temperature variation during measurement
Wafer film frame used for dicing wafer-substrate
FF-xx
Wafer film frame used for dicing wafer-substrate
  • Wafer size : 4, 6, 8, 12 Inch
  • Material : Stainless Steel, Aluminium, plastic

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12") Standard material Stainless steel (alu optional)Sizes and shapes adapted to the dicing equipment, Plastic models available for shipping purposes ...

Manual wafer/frame film mounter
UH114-x
Manual wafer/frame film mounter
  • Wafers & Substrates diameter : 6, 8, 12 Inch

Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm. Temperature controlled platenBuil-in circular cutter for cutting film on film frame, build-in end cutter for film separationOperates with backed or non backed filmsVacuum securing wafer stage offered in 2 versions (standard or thin-wafer-ch...

Semi-automatic wafer/frame film mounter
UH115-x
Semi-automatic wafer/frame film mounter
  • Wafers & Substrates diameter : 8, 12 Inch

Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12". "Crease line-free" lamination areaTemperature controlled platenBuil-in circular blade wheel for cutting film on film frameOperates with backed or non backed films, accepts all film frameVacuum securing wafer stage offered in different versions (standard, edge contact with only ...

UV Dicing Tape
F20-xx
UV Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 375@30' 308@24hr g/25mm
  • Thickness : 95 mm

PVC based film with UV sensitive adhesiveGood and homogeneous expansion after dicing in order to separate the dies for a safe pickingThe UV features alllow a high adhesion while dicing and a low adhesion after UV curing for pickingBacking layerPackaged in roll hermetic packing (metallized sleeve) ...

UV Antistatic Dicing Tape
F42-xx
UV Antistatic Dicing Tape
  • Color : Transparent
  • Adhesion force on Si before UV : 300@30' 550@24hr g/25mm
  • Thickness : 98 mm

Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.The tape has an antistatic layer which dissipates the negative charge build-upThe UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick upPackaged in roll hermetic packing (metallized sleeve) ...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171