Laminating Adhesive tape on Wafers and Frames

An adhesive tape is used to maintain the wafer during dicing operations. The tape is tensed onto a carrier frame. To insure a perfect process taking in consideration the fragility of the wafer and the active side, a specific equipment needs to be used and will provide a no-bubble lamination. Microworld will advise you upon review of your process and substrates size.
UH114
Manual wafer / frame film mounter
Manual wafer / frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

- Tape uniform tension
- Temperature controlled chuck
- Built-in circular cutter for cutting film on film frame, built-in end cutter for film separation
- Operates with backed or non backed films (UV tape)
- Accept metallic and plastic frames
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
UH115
Semi-automatic wafer / frame film mounter
Semi-automatic wafer / frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
F20-xx
UV dicing tape
UV dicing tape
- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)
F42-xx
UV antistatic dicing tape
UV antistatic dicing tape
- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)
FF-xx
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171