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Laminating Adhesive tape on Wafers and Frames

An adhesive tape is used to maintain the wafer during dicing operations. The tape is tensed onto a carrier frame. To insure a perfect process taking in consideration the fragility of the wafer and the active side, a specific equipment needs to be used and will provide a no-bubble lamination. Microworld will advise you upon review of your process and substrates size.
UH114-x
Manual wafer/frame film mounter
Manual wafer/frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

• Temperature controlled platen
• Buil-in circular cutter for cutting film on film frame, build-in end cutter for film separation
• Operates with backed or non backed films
• Vacuum securing wafer stage offered in 2 versions (standard or thin-wafer-chuck..)
UH115-x
Semi-automatic wafer/frame film mounter
Semi-automatic wafer/frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

• "Crease line-free" lamination area
• Temperature controlled platen
• Buil-in circular blade wheel for cutting film on film frame
• Operates with backed or non backed films, accepts all film frame
• Vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...)
• Buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size)
F20-xx
UV Dicing Tape
UV Dicing Tape
• PVC based film with UV sensitive adhesive
• Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
• The UV features alllow a high adhesion while dicing and a low adhesion after UV curing for picking
• Backing layer
• Packaged in roll hermetic packing (metallized sleeve)
F42-xx
UV Antistatic Dicing Tape
UV Antistatic Dicing Tape
• Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
• The tape has an antistatic layer which dissipates the negative charge build-up
• The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
• Packaged in roll hermetic packing (metallized sleeve)
FF-xx
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

• Standard material Stainless steel (alu optional)
• Sizes and shapes adapted to the dicing equipment, 
• Plastic models available for shipping purposes
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171