Wafer-film-frames

CONSUMABLE FOR DICING PROCESSES - Wafer-film-frames

Wafer film frames and griprings for 6" (150mm) or smaller, 8" (200mm), 12" (300mm) wafer sizes
• Material Stainless electropolish (optional Alu), Plastic, Lexan for griprings
• Sizes and models depending on the dicing machine, please consult
• Lower-cost plastic frames available for shipping purposes
FF-xx
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171