BACK-END PROCESSINGBack-end consumables

F07Standard dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

F08Standard dicing tape medium-high tackiness

Microworld offers a standard tape series for wafer dicing applications.

- Medium-High adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

F09Standard dicing tape low tackiness

Microworld offers a standard tape series for wafer dicing applications.

- Low adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

F05Standard dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium adhesion force
- PVC expandable base with acrylic adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

Microworld offers a standard tape series for wafer dicing applications.

- Medium-high adhesion force
- PVC expandable base with acrylic adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

F03Standard dicing tape high tackiness

Microworld offers a standard tape series for wafer dicing applications.

- High adhesion force
- PVC expandable base with rubber adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

F20UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)

F42UV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)

F43UV antistatic dicing tape

F44UV antistatic dicing tape

F27UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- Poly-Olefine based with acrylic adhesive and PET backing layer
- The UV sensitive adhesive offers a high adhesion force during dicing turning very low after UV cure ideal for dies pick up
- PVC core
- Packaged in roll hermetic packing (metallized sleeve)

LMKSMetal Dicing blade hubtype serie K&S

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures
- Diamond grit sizes range adapted to all dicing applications

LMFIMetal Dicing blade hubtype

LR2-3Hubless resin dicing blades

Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above.

- Hubless type, mount inside a flange separately supplied and interchangeable after use
- Variety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")
- The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicing
- Choice of bond hardnesses to favorize lifetime or quality of cut

MW-FLFlange for hubless dicing blades

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

- Material stainless steel or Titanium
- For blades up to 60 mm diameter
- The flange OD determines the blade exposure
- A dismounting tool (separately supplied) is needed to disassemble the flange

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes

APPlastic grip-ring

Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

ABOUT OUR Back-end consumables

We offer a wide range of consumables related to the back-end process.

- Dicing blade (metal, resin)
- Standard or UV dicing tape
- Frame and O-rings

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

Products Categories

LAYER CHARACTERIZATION

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BACK-END PROCESSING

PROBE TESTING

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CHARACTERIZATION OF ELECTRONIC LAYERS

INSTRUMENTATION CONTROL

ELECTRICAL TESTS UNDER NEEDLES