BACK-END PROCESSINGBack-end consumables

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Standard dicing tape

F07Standard dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll
Standard dicing tape medium-high tackiness

F08Standard dicing tape medium-high tackiness

Microworld offers a standard tape series for wafer dicing applications.

- Medium-High adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll
Standard dicing tape low tackiness

F09Standard dicing tape low tackiness

Microworld offers a standard tape series for wafer dicing applications.

- Low adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll
Standard dicing tape

F05Standard dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium adhesion force
- PVC expandable base with acrylic adhesive
- No silicone added (Contaminants-free)
- Packaged in roll
Standard thick dicing tape

F04Standard thick dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium-high adhesion force
- PVC expandable base with acrylic adhesive
- No silicone added (Contaminants-free)
- Packaged in roll
Standard dicing tape high tackiness

F03Standard dicing tape high tackiness

Microworld offers a standard tape series for wafer dicing applications.

- High adhesion force
- PVC expandable base with rubber adhesive
- No silicone added (Contaminants-free)
- Packaged in roll
UV dicing tape

F20UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)
UV antistatic dicing tape

F42BUV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)
UV antistatic dicing tape

F43UV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)
UV antistatic dicing tape

F43BUV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)
UV antistatic dicing tape

F44UV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)
UV dicing tape

F27UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- Poly-Olefine based with acrylic adhesive and PET backing layer
- The UV sensitive adhesive offers a high adhesion force during dicing turning very low after UV cure ideal for dies pick up
- PVC core
- Packaged in roll hermetic packing (metallized sleeve)
Metal Dicing blade hubtype serie K&S

LMKSMetal Dicing blade hubtype serie K&S

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures 
- Diamond grit sizes range adapted to all dicing applications
Metal Dicing blade hubtype

LMFIMetal Dicing blade hubtype

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures 
- Diamond grit sizes range adapted to all dicing applications
Hubless resin dicing blades

LR2-3Hubless resin dicing blades

Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above.

- Hubless type, mount inside a flange separately supplied and interchangeable after use
- Variety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")
- The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicing
- Choice of bond hardnesses to favorize lifetime or quality of cut
Flange for hubless dicing blades

MW-FLFlange for hubless dicing blades

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

- Material stainless steel or Titanium
- For blades up to 60 mm diameter
- The flange OD determines the blade exposure
- A dismounting tool (separately supplied) is needed to disassemble the flange

Wafer film frame used for dicing wafer-substrate

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
Wafer film frame used for dicing wafer-substrate_DUPLICATE

FF-1Wafer film frame used for dicing wafer-substrate_DUPLICATE

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
Plastic grip-ring

APPlastic grip-ring

Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

Plastic grip-ring_DUPLICATE

AP-UPlastic grip-ring_DUPLICATE

Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

ABOUT OUR Back-end consumables
We offer a wide range of consumables related to the back-end process.

- Dicing blade (metal, resin)
- Standard or UV dicing tape
- Frame and O-rings
For technical and commercial information, quote, ordering or request of visit by our representative.
+33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171