Our range of tapes for dicing (or backgrinding) presents a variety of models with different adhesion force (tackiness) and thickness depending on the die/substrate size. They are available in standard version with acrilyc adhesive or with UV sensitive adhesive. • The standard tapes (witouht UV adhesive) are more economical • The UV tapes have an adhesive wihic is sensitive to UV rays. After curing within specific wavelenght and power, the adhesion force becomes very low • The adhesion force can then be perfectly strong for dicing and low for die pick-up • The base film PVC (more expandable) with acrylic adhesive or PolyOlefin • No silicone added (contamination-free) for the standard tapes • Thickness 80 to 268 microns • Suitable for standard wafers ou thinner, or partial • Packaged in roll of 100 m long, any width
Choice of diamond dicing wheels for thin materials, Silicon, glass, ceramic... • Metal bond for semiconductor materials dicing and resin bond for hard and brittle materials • Standard low cost models or specific for dicing exotic materials • Free advices of recommended blades and starting parameters • Microworld has been providing dicing consumable since 1991
Wafer film frames and griprings for 6" (150mm) or smaller, 8" (200mm), 12" (300mm) wafer sizes • Material Stainless electropolish (optional Alu), Plastic, Lexan for griprings • Sizes and models depending on the dicing machine, please consult • Lower-cost plastic frames available for shipping purposes
Typically used following the tape expansion process, the grip-rings allow maintaining the tape well stretched for die-separation • Available for all wafer size up to 12" • Robust material Lexan for both inner and outer ring • Adapt on our UH130-132 expanders to tense the tape and separate dies
