Specific Request


APPLICATION : Laminating Adhesive tape on Wafers and Frames

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You have the right to access, modify, amend and delete information about yourself (art. 34 of the "Freedom and Information" act). In order to exercise this right you can contact: Microworld – 5 Rue de la Verrerie, 38120 Fontanil-Cornillon - Tel: 04 76 56 16 17

ABOUT : Laminating Adhesive tape on Wafers and Frames
An adhesive tape is used to maintain the wafer during dicing operations. The tape is tensed onto a carrier frame. To insure a perfect process taking in consideration the fragility of the wafer and the active side, a specific equipment needs to be used and will provide a no-bubble lamination. Microworld will advise you upon review of your process and substrates size.
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171