Part Number
LMKS
Designation
Metal Dicing blade hubtype serie K&S
APPLICATIONS
Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.
- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures
- Diamond grit sizes range adapted to all dicing applications
MOST POPULAR REFERENCES
Outside diameter
2.187 Inch
Inside diameter
0.75 Inch
Grit size
0.5 to 150 Inch