Our range of tapes for dicing (or backgrinding) presents a variety of models with different adhesion force (tackiness) and thickness depending on the die/substrate size. They are available in standard version with acrilyc adhesive or with UV sensitive adhesive.
• The standard tapes (witouht UV adhesive) are more economical
• The UV tapes have an adhesive wihic is sensitive to UV rays. After curing within specific wavelenght and power, the adhesion force becomes very low
• The adhesion force can then be perfectly strong for dicing and low for die pick-up
• The base film PVC (more expandable) with acrylic adhesive or PolyOlefin
• No silicone added (contamination-free) for the standard tapes
• Thickness 80 to 268 microns
• Suitable for standard wafers ou thinner, or partial
• Packaged in roll of 100 m long, any width
