ABOUT OUR Diamond dicing blades
We offer a complete range of cutting blades specifically designed to meet the demands of the semiconductor industry. Thanks to their precision, stability, and excellent cut quality, our solutions guarantee optimal throughput and reduced material waste during dicing operations.
Metal Blades:
Metal blades are particularly well-suited to applications requiring high cutting precision and excellent dimensional stability. Their metallic structure provides high rigidity, allowing for very tight tolerances, even on the most demanding materials.
Advantages:
• High cutting precision
• Excellent geometric stability
• Long service life
• Reduced chipping and surface defects
• Suitable for silicon, ceramic, glass, and composite wafers
Resin Blades:
Resin blades are designed for delicate applications requiring smooth and controlled cutting. Their resin bond ensures an excellent finish while minimizing mechanical stress on sensitive components.
Advantages:
• Smooth cutting and low stress generation
• Excellent surface finish
• Reduced chipping and microcracks
• Optimal performance on brittle materials
• Ideal for advanced semiconductors, thin substrates, and high-value electronic components
• A solution tailored to every application
Our experts will guide you in selecting the blade best suited to your manufacturing processes, taking into account material characteristics, cutting parameters, and quality requirements. Our goal is to provide you with reliable solutions that improve your productivity while guaranteeing impeccable cutting quality.
