ABOUT OUR Wafer film frame laminator machines
The UH114/UH115 are equipment for roll out adhesive film on wafers up to 300mm (12 inches).
In an ultra repeatable manner, they offer the possibility of mounting your tape without any air bubbles on a frame of different possible configuration.
These systems eliminate any human errors during this process because the lamination is carried out using a roller directly attached to the machine. In addition, a temperature controller ensures regular heating of the chuck which expands the film and promotes uniform bonding over the entire surface of the sample.
These machines therefore allow perfect maintain of your wafer during the dicing process.
Technical specifications:
- Available in 6", 8" or 12" version
- Manual or semi-automatic
- Uniform film tension over the entire surface
- Chuck heating to relax the film
- Circular cutting knife to cut the film on the frame
- Works on standard and UV adhesive films (with protective film take up for UV film)
- Accepts all types of metal or plastic frames
- Wafer held by vacuum
- Several types of chuck depending on the thickness and fragility of the wafer (standard, thin wafer, edge contact etc.)
- Adjustable height and planarity
- Anti-ESD system
