WB200      Semi-Automatic Wire Bonder

Description Technical Specifications Documents Associated Products

WB200      Semi-Automatic Wire Bonder

Description Technical Specifications Documents Associated Products

Part Number

WB200

Designation

Semi-Automatic Wire Bonder

Description

The WB200 series are the new generation of Wire bonders.

Enhanced functionality. Ball, Wedge & Bump.
Full manual Z Step control for prototyping or simple repair.
No mechanical set-up required.

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171