COMPONENTS TESTÌNG AND BURN INTest and Burn in sockets

SOKBGA      Standard test socket for BGA packages

SOKBGA : Standard test socket for BGA packages SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages SOKBGA : Standard test socket for BGA packages

Part Number

SOKBGA

Designation

Standard test socket for BGA packages

APPLICATIONS

Testing a new packaged component
Burn in of components for reliability testing
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Description

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer

MOST POPULAR REFERENCES

  • 130SQ 144B6618A : 144 pins Clamshell, 1mm pitch
  • 135055096U6617 : For BGA package 96 pins
  • 500SQ2397B6617 : For 2397-BGA device
  • 230SQ 484B6618C : For 484-BGA device
  • 270SQ 400B6618A : For 400-BGA device
  • 400SQ1517B6617 : Bor 1517-BGA device
  • 425SQ 560B6617 : For BGA560 device
  • 060SQ 036U6617 : For BGA 36 balls package
  • 130100064J6617 : For LGA 64 device
  • 170SQ 256B6618L : For BGA256 package - Surface mount socket
  • 400SQ 956B6617 : socket for BGA956 Package
  • 040SQ 049U6618A : For BGA 49 package
  • 140SQ 256U6618A : For 256 µBGA package
  • 140SQ 256U6618B : For 256 µBGA package
  • 150SQ 324U6618A : For BGA 324 package
  • 170SQ 256B6618D : For LFBGA256 device
  • 270SQ 676B6617 : For 676-BGA package
  • 013008006J6617 : For DSBGA6 device
  • 025SQ 016U6617 : For 16-BGA Device
  • 170SQ 256B6618K : For BGA256 Package
  • 049042014J6617 : For BGA 14 package
  • 060SQ 049J6618X : For LGA 49 package
  • 400SQ1517B6618A : For BGA 1517 ball box, thickness 3.89mm
  • 090SQ 121U6617 : For BGA 110 balls package
  • 080SQ 081U6617 : For BGA 81 balls package

Technical Specifications

Maximum temperature

175 std, 250 (option) °C

Contact spacing (pitch)

Greater than 0.22 mm

PCB mounting

SMD

Socket options

Non-magnetic, heat sink, zero insertion force...

Closing

ClamShell, OpenTop, Screw-lid, other...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171