SOKBGA      Standard test socket for BGA packages

SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages
SOKBGA : Standard test socket for BGA packages

Part Number

SOKBGA

Designation

Standard test socket for BGA packages

Description

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer

MOST POPULAR REFERENCES

  • 130SQ 144B6618A : 144 pins Clamshell, 1mm pitch
  • 135055096U6617 : For BGA package 96 pins
  • 500SQ2397B6617 : For 2397-BGA device
  • 230SQ 484B6618C : For 484-BGA device
  • 270SQ 400B6618A : For 400-BGA device
  • 400SQ1517B6617 : Bor 1517-BGA device
  • 425SQ 560B6617 : For BGA560 device
  • 060SQ 036U6617 : For BGA 36 balls package
  • 130100064J6617 : For LGA 64 device
  • 170SQ 256B6618L : For BGA256 package - Surface mount socket
  • 400SQ 956B6617 : socket for BGA956 Package
  • 040SQ 049U6618A : For BGA 49 package
  • 140SQ 256U6618A : For 256 µBGA package
  • 140SQ 256U6618B : For 256 µBGA package
  • 150SQ 324U6618A : For BGA 324 package
  • 170SQ 256B6618D : For LFBGA256 device
  • 270SQ 676B6617 : For 676-BGA package
  • 013008006J6617 : For DSBGA6 device
  • 025SQ 016U6617 : For 16-BGA Device
  • 170SQ 256B6618K : For BGA256 Package
  • 049042014J6617 : For BGA 14 package
  • 060SQ 049J6618X : For LGA 49 package
  • 400SQ1517B6618A : For BGA 1517 ball box, thickness 3.89mm
  • 090SQ 121U6617 : For BGA 110 balls package
  • 080SQ 081U6617 : For BGA 81 balls package

Technical Specifications

Maximum temperature

175 std, 250 (option) °C

Contact spacing (pitch)

Greater than 0.22 mm

PCB mounting

SMD

Socket options

Non-magnetic, heat sink, zero insertion force...

Closing

ClamShell, OpenTop, Screw-lid, other...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171