UH130      Semi-automatic Die Matrix expander

Description Technical Specifications Documents Associated Products

UH130      Semi-automatic Die Matrix expander

Description Technical Specifications Documents Associated Products

Part Number



Semi-automatic Die Matrix expander


The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300mm.

- Temperature-controlled heated stage
- 3-inch pneumatic vertical stroke control with speed control
- Upper and lower frame clamp assembly for different size wafers
- Grip ring automatic insertion


  • UH130-8 : 8" (200 mm) model
  • UH130-12 : 12" (300 mm) model

Technical Specifications

Wafers & Substrates diameter

2 to 12 "

Tape cutting

Automatic optional

Kind of piston


Piston range

50 mm

Piston speed adjustment


Heating plate

Yes (60°C max)

Ring insertion


Associated products

UH104 - Manual UV curing system
Benchtop low-profile system, the UH104 offers an exceptional flexibility and repeatability in the curing of UV films for dicing or backgrinding.

- Manual loading, automatic UV process
- Replaceable ozone-free UV lamp 365nm
- Ideal for Low volume and RnD applications
- Available in 8" (and smaller) or 12" version
- Frame or ring curing
UH114 - Manual wafer / frame film mounter
Manual wafer/frame film applicator with uniform adhesion film and no bubbles (wafer stress released), accepts all film frame styles, for wafers up to 300 mm.

- Tape uniform tension
- Temperature controlled chuck
- Built-in circular cutter for cutting film on film frame, built-in end cutter for film separation
- Operates with backed or non backed films (UV tape)
- Accept metallic and plastic frames
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
FF-xx - Wafer film frame used for dicing wafer-substrate
Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12")

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
AP-xx - Plastic Grip-Ring
Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of Lexan, a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

F20-xx - UV dicing tape
- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171