DO      Test socket for DO device

DO : Test socket for DO device

Part Number

DO

Designation

Test socket for DO device

Description

Burn in and Test sockets for all DO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

Technical Specifications

Maximum temperature

150 std, 250 (option) °C

Contact spacing (pitch)

Greater than 0.22 mm

PCB mounting

SMD, thru-holes, solder balls

Socket options

Non-magnetic, heat sink, zero insertion force...

Closing

ClamShell, OpenTop, Screw-lid, other...

For technical and commercial information, quote, ordering or request of visit by our representative.
+33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171