SOIC      Test socket for SOIC device

SOIC : Test socket for SOIC device

Part Number



Test socket for SOIC device


SOIC Test sockets (Burn-in).
All package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Designs ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

Technical Specifications

Maximum temperature

150 std, 250 (option) °C

Contact spacing (pitch)

Greater than 0.22 mm

PCB mounting

SMD, thru-holes, solder balls

Socket options

Non-magnetic, heat sink, zero insertion force...


ClamShell, OpenTop, Screw-lid, other...

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171