LAYER CHARACTERIZATIONFour point probe systemsFour point probe heads

CP4 Cylindrical 4 point probe head

Part Number

CP4

Designation

Cylindrical 4 point probe head

APPLICATIONS

Automatic with Mapping

Description

4-point head for measuring resistivity, resistance, surface resistance or thickness. For use on 280 series equipment or separately, standard tip spacing is 1mm. The pressure is adjustable directly on the head.

Specifications:

• Adjustable pressure on the probe head
• Tip radius of different sizes adapted to most electronics layers
• Termination by 9-pins connector for direct plug in
• Application at ambient temperature only

Technical Specifications

Tip radius

40, 100, 300, 500 µm

Spacing

1 mm

Pressure

Adjustable 60 to 150 g

Material

Tungsten carbide

Connections

Upon reference

Associated products

280I8" semi-automatic 4 point probe measurement system

Semi-automatic 4-point in-line measurement systems on samples ranging from 10mm to 200mm in diameter. Thanks to their motorized chucks, the 280I can map up to 6000 measurement points on surface resistance ranges from 1 mohm/sq to 8E5 Ohm/sq.

Specification:

• Extended range down to 8E11 Ohm/sq.
• Different versions adapted to the different resistance ranges tested
• Several types of mapping: 1pts, 5pts, 9pts, diagonal, Cartesian, custom etc..
• Powerful calculation algorithm
• Edge effect compensation, geometric factor
• SEC II Communication

Application:

- Si, Ge, SiGe, SiC, GaAs, InGaAs, InP, GaN, ZnO, TCOs
- Optoelectronic component
- Nanomaterials
- Sensors, MEMS
- Conductive polymer
- Oxide deposit
- Ceramic & Glass
- Batteries
- Electrodes
- Photovoltaic

333A12" semi-automatic 4 point probe measurement system

Semi-automatic 4-point in-line measurement systems on samples ranging from 10mm to 200mm in diameter. Thanks to their motorized chucks, the 333A can map up to 6000 measurement points on surface resistance ranges from 1 mohm/sq to 8E11 Ohm/sq.

Specification:

• Different versions adapted to the different resistance ranges tested
• Several types of mapping: 1pts, 5pts, 9pts, diagonal, Cartesian, custom etc..
• Powerful calculation algorithm
• Edge effect compensation, geometric factor
• SECS II Communication
• Possible version in Full-Automatic with loading of wafers via cassette and pre-alignment

Application:

- Si, Ge, SiGe, SiC, GaAs, InGaAs, InP, GaN, ZnO, TCOs
- Optoelectronic component
- Nanomaterials
- Sensors, MEMS
- Conductive polymer
- Oxide deposit
- Ceramic & Glass
- Batteries
- Electrodes
- Photovoltaic