BACK-END PROCESSINGBack-end consumablesDiamond dicing blades

LMFI      Metal Dicing blade hubtype

LMFI : Metal Dicing blade hubtype LMFI : Metal Dicing blade hubtype
LMFI : Metal Dicing blade hubtype LMFI : Metal Dicing blade hubtype

Part Number

LMFI

Designation

Metal Dicing blade hubtype

APPLICATIONS

  SIMILAR PRODUCTS   GET MORE DETAILS   SEND ME A QUOTE

Description

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures 
- Diamond grit sizes range adapted to all dicing applications

MOST POPULAR REFERENCES

  • LMFI5-1435 : Thick. 30-35µm, Exp. 0.89-1mm, Grit size 4-6µm
  • LMFI5-2035 : Thick. 45-50µm, Exp. 0.89-1mm, Grit size 4-6µm

Technical Specifications

Outside diameter

2.187 Inch

Inside diameter

0.75 Inch

Grit size

0.5 to 150 Inch

For technical and commercial information, quote, ordering or request of visit by our representative.
+33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171