AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring
AP : Plastic grip-ring

Part Number



Plastic grip-ring


Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm


  • AP8 : For 200 mm (8") wafer • OD 241 mm • ID 225 mm • Orange & yellow
  • AP4 : For 100 mm (4") wafer • OD 152 mm • ID 140 mm • Green & yellow
  • AP6 : For 150 mm (6") wafer • OD 210 mm • ID 195 mm • Blue & yellow

Technical Specifications

Wafer size

4, 6, 8, 12 "

Inside diameter

Upon reference

Outside diameter

Upon référence


6 mm


Polycarbonate (Lexan)

Associated products

Semi-automatic die matrix expander

UH130Semi-automatic die matrix expander

The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300 mm.Thanks to ultra-precise control of the separation process, it allows a higher throughput and increased efficiency in the treatment of micro-components.
UH130 equipment facilitates this by maintaining the orientation of the dies and a constant spacing thereof. It is compatible with a wide range of frames (and therefore wafer sizes) as well as all types of adhesive films (standard, UV, extra-adhesive, etc.)

Technical specifications:

• 8" and 12" compatible
• Pneumatic cylinder with speed control and 2.3" adjustable stroke (cylinder height)
• Motorized circular cutting assembly
• Emergency stop with manual clamp
• Chuck heated and temperature controlled digitally with thermistor
• Adjustable stroke stop, allowing constant repeatability of expansion
• Plexiglas protective cover, antistatic
• Precisely controlled die separation distance for consistent repeatability
• Alignment markers allow easy and precise placement of the film frame
• Reduced alignment times and increased throughput of automated processes
• Convenient: tabletop system, easy to use
• Operator variables virtually eliminated


- Motorized circular cutting set
- Possible ring/ring version

Wafer film frame used for dicing wafer-substrate

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
UV dicing tape

F20UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171