UH115 - Semi-automatic wafer / frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".
- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
