SOKQFN      Standard test socket for QFN packages

Description Technical Specifications Documents Associated Products

SOKQFN      Standard test socket for QFN packages

Description Technical Specifications Documents Associated Products

Part Number

SOKQFN

Designation

Standard test socket for QFN packages

Description

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

Technical Specifications

Max temperature

175 std, 250 (option) °C

Contact spacing (pitch)

Greater than 0.22 mm

PCB mounting

SMD, thru-hole, other

Socket options

Non-magnetic, heat sink, zero insertion force...

Closing

ClamShell, OpenTop, Screw-lid, other...

Associated products

UH115 - Semi-automatic wafer / frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

- User dependant bubbles elimination
- Temperature controlled chuck
- Built-in circular blade wheel for cutting film on film frame
- Operates with backed (UV tape) or non backed films
- Wafer held by vacuum
- Wafer stage offered in several versions (standard, thin-wafer-chuck..)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171