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SOKQFN      Standard test socket for QFN packages

Description Technical Specifications Documents Associated Products

SOKQFN      Standard test socket for QFN packages

Description Technical Specifications Documents Associated Products

Description

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

Technical Specifications

Max temperature

Contact spacing (pitch)

PCB mounting

Socket options

Closing

175 std, 250 (option) °C

Greater than 0.22 mm

SMD, thru-hole, other

Non-magnetic, heat sink, zero insertion force...

ClamShell, OpenTop, Screw-lid, other...

Associated products

UH115-x - Semi-automatic wafer/frame film mounter
Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

• "Crease line-free" lamination area
• Temperature controlled platen
• Buil-in circular blade wheel for cutting film on film frame
• Operates with backed or non backed films, accepts all film frame
• Vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...)
• Buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size)
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171