SOKQFN      Standard test socket for QFN packages

SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages
SOKQFN : Standard test socket for QFN packages

Part Number

SOKQFN

Designation

Standard test socket for QFN packages

Description

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

Technical Specifications

Maximum temperature

175 std, 250 (option) °C

Contact spacing (pitch)

Greater than 0.22 mm

PCB mounting

SMD, thru-hole, other

Socket options

Non-magnetic, heat sink, zero insertion force...

Closing

ClamShell, OpenTop, Screw-lid, other...

Associated products

Semi-automatic wafer / frame film mounter

UH115Semi-automatic wafer / frame film mounter

The UH115 are a semi-automatic wafer film mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves automatically along the substrate after pressing a push button, ensuring an ultra-repeatable process. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171