SOKQFN - Standard test socket for QFN packages

Part Number

SOKQFN

Designation

Standard test socket for QFN packages

APPLICATIONS

Testing a new packaged component

Burn in of components for reliability testing

Description

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DOCUMENTS

Extract QFN Sockets List (.jpg)

Technical Specifications

Max temperature

Contact spacing (pitch)

PCB mounting

Socket options

Closing

175 std, 250 (option) °C

Greater than 0.22 mm

SMD, thru-hole, other

Non-magnetic, heat sink, zero insertion force...

ClamShell, OpenTop, Screw-lid, other...

Associated products

UH115-x - Semi-automatic wafer/frame film mounter

EQUIPMENT FOR DICING AND RELATED PROCESSESWafer frame laminators

Semi-automatic wafer/frame film applicator with motor-assisted film unwinding one-pass lamination, for wafers up to 12".

• "Crease line-free" lamination area
• Temperature controlled platen
• Buil-in circular blade wheel for cutting film on film frame
• Operates with backed or non backed films, accepts all film frame
• Vacuum securing wafer stage offered in different versions (standard, edge contact with only peripheral contact for bumped wafers or fragile...)
• Buil-in end cutter for film separation, allows mounting of thin wafers (min thickness depending on size)