Quote Request


* Mandatory fields

You have the right to access, modify, amend and delete information about yourself (art. 34 of the "Freedom and Information" act). In order to exercise this right you can contact: Microworld – 5 Rue de la Verrerie, 38120 Fontanil-Cornillon - Tel: 04 76 56 16 17


Semi-automatic die matrix expander

The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300 mm.Thanks to ultra-precise control of the separation process, it allows a higher throughput and increased efficiency in the treatment of micro-components.
UH130 equipment facilitates this by maintaining the orientation of the dies and a constant spacing thereof. It is compatible with a wide range of frames (and therefore wafer sizes) as well as all types of adhesive films (standard, UV, extra-adhesive, etc.)


Technical specifications:

• 8" and 12" compatible
• Pneumatic cylinder with speed control and 2.3" adjustable stroke (cylinder height)
• Motorized circular cutting assembly
• Emergency stop with manual clamp
• Chuck heated and temperature controlled digitally with thermistor
• Adjustable stroke stop, allowing constant repeatability of expansion
• Plexiglas protective cover, antistatic
• Precisely controlled die separation distance for consistent repeatability
• Alignment markers allow easy and precise placement of the film frame
• Reduced alignment times and increased throughput of automated processes
• Convenient: tabletop system, easy to use
• Operator variables virtually eliminated

Options:

- Motorized circular cutting set
- Possible ring/ring version

For technical and commercial information, quote, ordering or request of visit by our representative.
+33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171