UH104 Manual UV curing system

Part Number

UH104

Designation

Manual UV curing system

APPLICATIONS

Curing UV tape after dicing

Description

Benchtop low-profile system, the UH104 offers an exceptional flexibility and repeatability in the curing of UV films for dicing or backgrinding.UV insolators are illumination systems allowing the rapid curing of all types of photo-sensitive materials. Mainly used in the semiconductor world, they solidify the glue present on the adhesive films used during the cutting process. Safe for the environment, this UV curing process takes place at room temperature and at a wavelength of 365nm.

Technical specifications:

• Compact 8" or 12" system
• Manual loading, automatic process
•Rectangular substrates up to 12"
• Environmentally friendly, ozone-free UV lamp
• Fast curing time
• Easily programmable microprocessor based controller
• Repeatable manual operation
• Exceptional cost/performance ratio
• Low temperature 365nm UVA curing process
• Very energy efficient
• Quartz glass window
• Lamp intensity measurement port

Options:

- LED version possible
- Motorized and rotating work platform
- 6" or 8" film frame adapter
- UV Lamp Intensity Radiometer (requires sensor/attenuator assembly, below)
- Sensor/attenuator assembly (requires radiometer above)

DOCUMENTS

UH104 UV curing system (pdf)

Technical Specifications

Wafers & Substrates diameter

2 to 12 "

Wavelenght of the UV lamp

365 nm

Curing time adjustment

Yes

Ozon generation

Curing support type

Frame or Ring

Power supply

230VAC / 50Hz / Mono / 3A

Associated products

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes

APPlastic grip-ring

Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

F20UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)

F42UV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)