FFWafer film frame used for dicing wafer-substrate
- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes
Part Number
UH104
Designation
Manual UV curing system
APPLICATIONS
Benchtop low-profile system, the UH104 offers an exceptional flexibility and repeatability in the curing of UV films for dicing or backgrinding.UV insolators are illumination systems allowing the rapid curing of all types of photo-sensitive materials. Mainly used in the semiconductor world, they solidify the glue present on the adhesive films used during the cutting process. Safe for the environment, this UV curing process takes place at room temperature and at a wavelength of 365nm.
Technical specifications:
• Compact 8" or 12" system
• Manual loading, automatic process
•Rectangular substrates up to 12"
• Environmentally friendly, ozone-free UV lamp
• Fast curing time
• Easily programmable microprocessor based controller
• Repeatable manual operation
• Exceptional cost/performance ratio
• Low temperature 365nm UVA curing process
• Very energy efficient
• Quartz glass window
• Lamp intensity measurement port
Options:
- LED version possible
- Motorized and rotating work platform
- 6" or 8" film frame adapter
- UV Lamp Intensity Radiometer (requires sensor/attenuator assembly, below)
- Sensor/attenuator assembly (requires radiometer above)
MOST POPULAR REFERENCES
Wafers & Substrates diameter
2 to 12 "
Wavelenght of the UV lamp
365 nm
Curing time adjustment
Yes
Ozon generation
No
Curing support type
Frame or Ring
Power supply
230VAC / 50Hz / Mono / 3A