MPS Mini Placer System

Part Number

MPS

Designation

Mini Placer System

Description

Very light Epoxy Die Bonder solution, MPS requires minimal training to operate.

The MPS fulfils accurate Picking and Placement of delicate devices.
Tool holder design, rocking Head, provides an easy solution for gluing.

Associated products

WB200Semi-Automatic Wire Bonder

The WB200 series are the new generation of Wire bonders.

Enhanced functionality. Ball, Wedge & Bump.
Full manual Z Step control for prototyping or simple repair.
No mechanical set-up required.

PP-ONEManual Placer

Multipurpose plateform for pick and place.
Small production ( < 500 000 pieces/year).

The Manual Sorter PP-One model is designed for accurate Picking and Placement of delicate devices as Laser Diodes and Laser Bars.
The machine will pick the components from wafer hoops to place them into GelPack or Waffle Packs.

PP6Universal Die Bonder system

It's the most versatile semi automatic Pick & Place platform.
It can be used in a wide field of applications such as ASIC, MMIC, MEMS or VECEL.

PP5 and PP6 are user friendly, flexible and requires minimal training to operate.

Eutectic and Epoxy available.

WB100Semi automatic Wire-Bonder

The WB-100 series are designed as multi-purposes semiautomatic wire bond tools for R&D purpose and small series production.

Its flat bench Top size allows easy carriage and also operation.

Since 10 years our WB-100 is a successful established equipment on the worldwide market.

For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171