BACK-END PROCESSINGBack-end consumablesAdhesive tapes

F09 Standard dicing tape low tackiness

Part Number

F09

Designation

Standard dicing tape low tackiness

APPLICATIONS

Wafers and other materials Dicing

Description

Microworld offers a standard tape series for wafer dicing applications.

- Low adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

DOCUMENTS

F dicing tape brochure (pdf)

Technical Specifications

Length

100 m

Width

25 to >450 mm

Color

Blue

Tape material

PVC

Packaging

Roll

Adhesion force on SS

30@30' 50@24hr g/25mm

Thickness

80 µm

Associated products

UH130Semi-automatic die matrix expander

The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300 mm.Thanks to ultra-precise control of the separation process, it allows a higher throughput and increased efficiency in the treatment of micro-components.
UH130 equipment facilitates this by maintaining the orientation of the dies and a constant spacing thereof. It is compatible with a wide range of frames (and therefore wafer sizes) as well as all types of adhesive films (standard, UV, extra-adhesive, etc.)

Technical specifications:

• 8" and 12" compatible
• Pneumatic cylinder with speed control and 2.3" adjustable stroke (cylinder height)
• Motorized circular cutting assembly
• Emergency stop with manual clamp
• Chuck heated and temperature controlled digitally with thermistor
• Adjustable stroke stop, allowing constant repeatability of expansion
• Plexiglas protective cover, antistatic
• Precisely controlled die separation distance for consistent repeatability
• Alignment markers allow easy and precise placement of the film frame
• Reduced alignment times and increased throughput of automated processes
• Convenient: tabletop system, easy to use
• Operator variables virtually eliminated

Options:

- Motorized circular cutting set
- Possible ring/ring version

UH114Manual wafer / frame film mounter

The UH114 are manual wafer film (wafer mounter) mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves manually along the substrate once the film is stuck. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system

UH115Semi-automatic wafer / frame film mounter

The UH115 are a semi-automatic wafer film mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves automatically along the substrate after pressing a push button, ensuring an ultra-repeatable process. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes

LR22" hubless resin dicing blades

Resin diamond blades are specifically designed for high-precision cutting applications in the semiconductor industry. Thanks to their optimized structure, they offer a smooth and controlled cutting action, minimizing mechanical stress on components while ensuring excellent surface finish quality.

Particularly suited to fragile materials and thin wafers, they produce clean cuts with minimal chipping and micro-cracks.

The resin bond ensures constant renewal of the diamond grains during the cutting operation, guaranteeing an excellent balance between performance, surface finish quality, and wear control. This technology is especially recommended when the quality of the cutting edge and component protection are critical requirements.

Advantages:

• Excellent surface quality after cutting
• Significant reduction in chipping and edge defects
• Low mechanical stress on sensitive substrates
• Precise and consistent cutting
• Wide range of diamond grit sizes
• Optimized production throughput
• Compatible with leading diking equipment on the market

Applications:

- Silicon (Si) wafers
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Technical glass and ultra-thin glass
- Advanced ceramics
- Electronic substrates
- Optoelectronic components
- MEMS, sensors, and power devices
- Technology dedicated to precision