F44      UV antistatic dicing tape

F44 : UV antistatic dicing tape
F44 : UV antistatic dicing tape

Part Number



UV antistatic dicing tape


Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)


  • F44-12.0 : 304 mm width
  • F44-17.0 : 432 mm width

Technical Specifications


100 m


25 to >450 mm



Tape material




Adhesion force on Si before UV

350@30' 650@24hr g/25mm

Adhesion force on Si After UV

29@30' 35@24hr g/25mm


268 µm

Associated products

Semi-automatic die matrix expander

UH130Semi-automatic die matrix expander

The UH130 automatically expands the adhesive tape so as to present the dies in an evenly spaced parallel matrix to facilitate pick-and-place or die bonding operations, adapt to all wafer/film frame up to 300 mm.Thanks to ultra-precise control of the separation process, it allows a higher throughput and increased efficiency in the treatment of micro-components.
UH130 equipment facilitates this by maintaining the orientation of the dies and a constant spacing thereof. It is compatible with a wide range of frames (and therefore wafer sizes) as well as all types of adhesive films (standard, UV, extra-adhesive, etc.)

Technical specifications:

• 8" and 12" compatible
• Pneumatic cylinder with speed control and 2.3" adjustable stroke (cylinder height)
• Motorized circular cutting assembly
• Emergency stop with manual clamp
• Chuck heated and temperature controlled digitally with thermistor
• Adjustable stroke stop, allowing constant repeatability of expansion
• Plexiglas protective cover, antistatic
• Precisely controlled die separation distance for consistent repeatability
• Alignment markers allow easy and precise placement of the film frame
• Reduced alignment times and increased throughput of automated processes
• Convenient: tabletop system, easy to use
• Operator variables virtually eliminated


- Motorized circular cutting set
- Possible ring/ring version

Manual wafer / frame film mounter

UH114Manual wafer / frame film mounter

The UH114 are manual wafer film mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves manually along the substrate once the film is stuck. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system
Wafer film frame used for dicing wafer-substrate

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
Hubless resin dicing blades

LR2-3Hubless resin dicing blades

Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above.

- Hubless type, mount inside a flange separately supplied and interchangeable after use
- Variety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")
- The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicing
- Choice of bond hardnesses to favorize lifetime or quality of cut
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171