F03      Standard dicing tape high tackiness

F03 : Standard dicing tape high tackiness
F03 : Standard dicing tape high tackiness

Part Number

F03

Designation

Standard dicing tape high tackiness

Description

Microworld offers a standard tape series for wafer dicing applications.

- High adhesion force
- PVC expandable base with rubber adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

MOST POPULAR REFERENCES

  • F03-14.0 : 355 mm width
  • F03-3.5 : 89 mm width
  • F03-9.0 : 229 mm width

Technical Specifications

Length

100 m

Width

25 to >450 mm

Color

Blue

Tape material

PVC

Packaging

Roll

Adhesion force on Si

350@30' 520@24hrs g/25mm

Thickness

139 µm

Associated products

Manual wafer / frame film mounter

UH114Manual wafer / frame film mounter

The UH114 are manual wafer film mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves manually along the substrate once the film is stuck. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system
Semi-automatic wafer / frame film mounter

UH115Semi-automatic wafer / frame film mounter

The UH115 are a semi-automatic wafer film mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves automatically along the substrate after pressing a push button, ensuring an ultra-repeatable process. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system
Wafer film frame used for dicing wafer-substrate

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment, 
- Plastic models available for shipping purposes
Plastic grip-ring

APPlastic grip-ring

Used to maintain the adhesive tape during dicing processes or typically after the tape expansion, the plastic rings is composed of a pair (inner and outer ring) made of polycarbonate (Lexan), a strong a light fiberglass material.

- They can hold the expanded plastic film and the dies largely separated for a safe picking
- Available for wafers up to 300 mm

Hubless resin dicing blades

LR2-3Hubless resin dicing blades

Resin bond diamond dicing blades thickness from 38 microns to 1 mm and above.

- Hubless type, mount inside a flange separately supplied and interchangeable after use
- Variety of diameters to fill all applications, from 51 mm (2") to 117 mm (4.6")
- The diamond grit size ranges from 0.5 to 150 microns allows responding to all exotic materials dicing
- Choice of bond hardnesses to favorize lifetime or quality of cut
For technical and commercial information, quote, ordering or request of visit by our representative. +33 (0)476 561 617

5 rue de la Verrerie

38120 Le Fontanil-Cornillon

Grenoble / France

Fax : +33(0) 476 757 484

RCS Grenoble B 381 001 171 - APE 4652Z

TVA FR 48 381 001 171